Influence of thermal cycling on shear strength of Cu-Sn3.5AgIn-Cu joints with various content of indium

Journal of Alloys and Compounds

Volumn 463, Issue 1-2, 2008, Pages 168-172

  Šebo, Pavol ^a   Švec, Peter ^b   Janičkovič, Dušan ^b   Štefánik, Pavol ^a  

^a INSTITUTE OF MATERIALS AND MACHINE MECHANICS   (Slovakia)

^b INSTITUTE OF PHYSICS   (Slovakia)

Author keywords

Cu joints; Shear strength; Sn Ag In system; Thermal cycling; X ray analysis

Indexed keywords

BRAZING; COPPER ALLOYS; INDIUM; METALLIC COMPOUNDS; QUENCHING; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRENGTH OF MATERIALS; THERMAL CYCLING; TIN; WELDING;

NUMBER OF CYCLES; ROOM-TEMPERATURE (RT); STRENGTH (IGC: D5/D6);

COPPER;

EID: 48949118260     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.09.014     Document Type: Article

References (8)

1. Ipser H. Proceedings COST 531 Action: Lead-free Solder Materials. Mid-Term Meeting. Dipartimento di Chimica e Chimica Industriale Universitá degli Studi di Genova, February 23-24 (2006) 11
2. Vassilev G.P., Dobrev E.S., and Tedenac J.-C. J. Alloys Compd. 399 (2005) 118-125
3. CHang T.-C.H., Wang M.-C.H., and Hon M.-H. J. Alloys Compd. 402 (2005) 141-148
4. Garzel G., and Fima P. Monatsh. Chem. 136 (2005) 1841
5. CHen S.-W., Wang C.H.-H., Lin S.-K., and CHin C.H.-K. J. Mater. Sci. Mater. Electron. 18 (2007) 19-37
6. Unifantowicz P., Janczak-Rusch J., Rutti T., and Kurzydlowski K.J. Proceedings COST 531 Action: Lead-free Solder Materials. Mid-Term Meeting. Ecole Polytechnique Fédérale de Lausanne, Lausanne, 24-25 February (2005) 45
7. Choi W.K., Yoon S.W., and Lee H.M. Mater. Trans. 42 (2001) 783
8. Šebo P., and Štefánik P. Kovove Mater. 43 (2005) 202-209