Modeling non-isothermal intermetallic layer growth in the 63Sn-37Pb/Cu system

TMS Annual Meeting

Volumn , Issue , 1997, Pages 161-170

  Vianco, P T ^a   Hopkins, P L ^a   Erickson, K L ^a   Frear, D R ^a   Davidson, R ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; CODES (SYMBOLS); COMPUTER SIMULATION; COMPUTER SOFTWARE; DIFFUSION IN SOLIDS; ELECTRONICS PACKAGING; GROWTH (MATERIALS); INTERFACES (MATERIALS); INTERMETALLICS; TIN ALLOYS;

ARRHENIUS EXPRESSIONS;

SOLDERING ALLOYS;

EID: 0031352334     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)