Solid-state reactions between Cu(Ni) alloys and Sn

Journal of Electronic Materials

Volumn 36, Issue 10, 2007, Pages 1355-1362

  Vuorinen, Vesa ^a   Laurila, Tomi ^a   Mattila, Toni ^a   Heikinheimo, Erkki ^a   Kivilahti, Jorma K ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Intermetallic reactions; Kinetics; Kirkendall voids; Sn Cu Ni system; Thermodynamics

Indexed keywords

INTERMETALLIC REACTIONS; KIRKENDALL VOIDS; SN-CU-NI SYSTEM;

DIFFUSION; INTERMETALLICS; SOLID STATE REACTIONS; THERMAL EFFECTS; THERMODYNAMICS; TIN; VOID FRACTION;

COPPER ALLOYS;

EID: 34848841223     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0251-0     Document Type: Article

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