The role of intermetallic compounds in lead-free soldering

Soldering and Surface Mount Technology

Volumn 10, Issue 3, 1998, Pages 38-52

  Harris, Paul G ^a   Chaggar, Kaldev S ^a  

^a ITRI Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; EMBRITTLEMENT; GROWTH (MATERIALS); MICROSTRUCTURE; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; ELECTRONICS PACKAGING; SEMICONDUCTING INTERMETALLICS;

MELTING POINT; STRENTHENING EFFECT; LEAD-FREE SOLDERING;

INTERMETALLICS; SOLDERING;

EID: 0242264129     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919810237110     Document Type: Article

References (32)

1. Westbrook, J.H. (Ed.). Intermetallic Compounds, John Wiley & Soar Ltd. 1967, New York, NY and Chichester.
2. Ainsworth, P.A. Gold Balletin, Vol. 4 No. 3, 1971, pp. 47-50.
3. Denman, R.D., Soldering to Gold Coatings, ITRI publication, No. 736, 1996.
4. Engelmaier, W., "Soldering: why we're still struggling", Circuits Assembly, Vol. 8 No. 2, 1997, pp. 68, 70, 72, 125.
5. Unpublished work (1998), ITRI.
6. Swanger, W.H. and Maupin, A.R., "Strength of soft soldered joints in copper tubing", J. Res. Nat. Burean of suts. Vol. 36, 1968, p. 83.
7. Chadwick, R.J., "The influence of surface alloying on the strength of solf soldered joints", Journal of the Institute of Metals, Vol. 62, 1938, pp. 277-95.
8. Bader, W.G., Proceedings, "Physical metallurgy of metal joining seminar", The Metallurgical Society of AIME, 1980, pp. 257-69.
9. Thwaites, C.J., "The solderability of tin/tin ally and other metallic coatings", Trans Inst. Meatl Finish., Vol. 36 No. 6, 1959, pp. 203-19.
10. Manko, H.H., Solders and Soldering, McGraw-Hill, New York, NY, 1964.
11. Steen, H.A.H., The Effect of Impurities on the Microstructure and Solidification Behaviour of Eutectic Sn-Pb Solders, Swedish Institute for Metals Research, Report No. IM-1643, 1982.
12. Fraber, G., "Mechanical properties of soft soldered joints at elevanted temperatures", Brown Bovrin Review, Vol. 49, 1964, pp. 11-13.
13. Starke, E. and Wever, H., "Diffusion and Kirkendall effect in intermetallic phases of copper-tin systems", Z. Metallkunde, Vol. 53 No. 3, 1964, pp. 107-16.
14. Haimovich, J., Intermetallic compound growth in tin and tin-lead plating over nickel and its effects on solderability", Welding Journal: Research Supplement, Vol. 102, 1989, pp. 102-11.
15. Hunt, J.D. and Chilton, J.P., "An investigation of the lamella-rod transition in binary eutectics", Journal of the Institute of Metals. Vol. 91 No. 10, 1963, pp. 338-12.
16. Thwaites, C.J., "Solderabilily of coatings for printed circuits", Trans Inst. Metal Finish., Vol. 43 No. 4, 1965, pp. 143-52.
17. Harman, A.C., "Rapid tin-nickel intermetallic growth: some effects on solderability", Proceedings, INTERNEPCON, Brighton, 1978, pp. 42-9.
18. Harris, P.G., Chaggar, K.S. and Whitmore, M.A., "The effect of ageing on the microstructure of 60:40 tin-lead solders", Sold. & Surf. Mount Techn., No. 7, 1991, pp. 20-3, 33.
19. Unsworth, D.A. and MacKay, C.A., "A preliminary report on growth of compound layers on various metal bases plated with tin and tin alloys", Trans. Ints. Metal Finish., Vol. 51, 1965. p. 85.
20. Chalmers, B., Physical Metallurgy, John Wiley & Sons, New York, NY and Chichester, 1959.
21. Ohriner, E.K., "Intetmetallic formation in soldered copper-based alloys at 150°C to 250°C", Welding Journal: Research Supplement, July, 1987, pp. 191-202.
22. Zurn, N. and Nesse, T. "Metallurgical processes during soft soldering of copper and its alloys and the strength behaviour of soldered joints", Metall., Vol. 20 No. 11, 1966, pp. 1144-51.
23. Flemings M.C., Solidification Processing, McGraw-Hill Book Co., New York, NY, 1974.
24. Bastow, B.D. and Kirkwood, D.H., "Solid/liquid equilibrium in the copper-nickel-tin system determined by microprobe analysis", Journal of the Institute of Metals, Vol. 99, 1971, pp. 277-83.
25. Beling, R.E. and Wever, H., "Self-diffusion and transport mechanism in the λ and δ- phases of the copper-tin system", Z. Metallbande. Vol. 59 No. 3, 1968, pp. 222-6.
26. Kay, P.J. and MacKay, C.A., "The growth of intermatallic compounds on common bais materals coated with tin and tin-lead alloys", Trans. Inst. Metal Finish., Vol. 54, 1976, pp. 68-74.
27. Mazzoleni, F., "Part I, Hume-Rothery phases in alloys with more than two compounds. Part 2, phases with ratio 7:4 in the nickel-copper-tin system: Part 3, phases with ration 3:2 and 21:12 in the nickel-copper-tin system", Metallargia Ind., October, 1953, pp. 363-73.
28. Hagstrom, R. and Wild, R., "Evaluation of volders for IBM system 14-Pi computers", Proceedings INTERNEPCON, Brighton, 1969, pp. 271-86.
29. Kay, P.J. and MacKay, C.A., "Barrier layers against diffustion", Trans. Inst. Metal Finish., Vol. 57, 1979, pp. 169-74.
30. Gerth, D., "Examination of the diffusion layers of soft-soldered copper joints by electron probe microanalyser", Metall., No. 8, 1970, pp. 838-46.
31. Warwick, M.E. and Muckett, S.J., "Observation on the growth and impact of intermetallic compounds on tin-coated substrates", Circuit World, Vol. 9 No. 4, 1983, pp. 5-11.
32. London, J. and Ashall, D.W., "Compound growth and fracture at copper/tin-silver solder interfaces", Brazing and Soldering, No. 11, 1986, pp. 49-55.