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Materials Science and Engineering: A

Volumn 373, Issue 1-2, 2004, Pages 187-194

Joint reliability and high temperature stability of Sn-Ag-Bi lead-free solder with Cu and Sn-Pb/Ni/Cu substrates

(2) Hwang, Chi Won a Suganuma, Katsuaki a

a OSAKA UNIVERSITY (Japan)

Author keywords

Bi segregation; Joint strength; Lead free solder; Ni layer; Sn Ag Bi

Indexed keywords

BISMUTH COMPOUNDS; CONCENTRATION (PROCESS); HIGH TEMPERATURE EFFECTS; MECHANICAL PROPERTIES; MICROSTRUCTURE; SEGREGATION (METALLOGRAPHY); SILVER COMPOUNDS;

HIGH TEMPERATURE; JOINT RELIABILITY; SOLDER;

TIN COMPOUNDS;

SOLDER; STRENGTH ASSESSMENT; WELDING;

EID: 2442441863 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2004.01.019 Document Type: Article

Times cited : (24)

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