Combined thermodynamic-kinetic analysis of the interfacial reactions between Ni metallization and various lead-free solders

Materials

Volumn 2, Issue 4, 2009, Pages 1796-1834

  Laurila, Tomi ^a   Vuorinen, Vesa ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Diffusion; Electroless Ni; Intermetallic compound layers; Lead free solders; Phase diagram; Thermodynamics

Indexed keywords

CU CONCENTRATIONS; ELECTROLESS NI; ELECTROLESS NI/IMMERSION AU; INTERFACIAL PHENOMENA; INTERMETALLIC COMPOUND LAYER; LEAD FREE SOLDERS; LOW TEMPERATURES; THERMODYNAMIC INFORMATION;

COPPER COMPOUNDS; DIFFUSION; GOLD; METALLIZING; NICKEL; PHASE DIAGRAMS; SOLDERING ALLOYS; THERMODYNAMICS;

TIN;

EID: 77949489265     PISSN: None     EISSN: 19961944     Source Type: Journal    
DOI: 10.3390/ma2041796     Document Type: Article

References (76)

1. Laurila, T.; Vuorinen, V.; Kivilahti, J.K. Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng. R 2005, R49, 1-60.
2. Houghton, F.D.B. TRI project on electroless nickel/immersion gold joint cracking. Circuit World 2000, 26, 10-16.
3. Hribar, V.F.; Bauer, J.L.; O'Donnell, T.P. Microstructure of electroless nickel-solder interactions. In Proc. 3rd Inter. SAMPE Electronics Conf., San Diego, CA, USA, June 20-22, 1989; pp. 1187-1199.
4. Puttlitz, K. Corrosion of Pb-50In flip-chip interconnections exposed to harsh environment. IEEE Trans. CHMT 1990, 13, 647-655.
5. Bradley, E.; Banerji, K. Effect of PCB finish on the reliability and wettability of ballgrid array packages. In Proc. 45th Electronic Components and Technology Conference, Las Vegas, NV, USA, May 21-24, 1995; pp. 1028-1038.
6. Mei, Z.; Callery, P.; Fisher, D.; Hua, F.; Glazer, J. Interfacial Fracture Mechanism of BGA Packages on Electroless Ni/Au. In Proc. Pacific Rim/ASMEInter. Intersociety Electronic and Photonic Packaging Conf., Advances in Electronic Packaging 1997; ASME: New York, NY, USA, June 15-19, 1997; pp. 1543-1550.
7. Kang, H.B.; Bae, J.H.; Lee, J.W.; Park, M.H.; Yoon, J.W.; Jung, S.B.; Yang, C.W. Characterization of interfacial reaction layers formed between Sn-3.5Ag solder and electroless Niimmersion Au-plated Cu substrates. J. Electr. Mater. 2008, 37, 84-89.
8. Vuorinen, V.; Laurila, T.; Yu, H.; Kivilahti, J.K. Phase formation between Lead-free SnAgCu Solder and Ni(P)/Au Finishes. J. Appl. Phys. 2006, 99, 3530-3536.
9. Mei, Z.; Kaufmann, M.; Eslambolchi, A.; Johnson, P. Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold. In Proc. 48th Electronic Components and Technology Conference, Seattle, Washington, USA, May 25-28, 1998; pp. 952-961.
10. Mei, Z.; Johnson, P.; Kaufmann, M.; Eslambolchi, A. Effect of electroless Ni/immersion Au plating parameters on PBGA solder joint attachment reliability. In Proc. 49th Electronic Components and Technology Conference, San Diego, CA, USA, June 1-4, 1999, 1999; pp. 125-134.
11. Laurila, T.; Vuorinen, V.; Kivilahti, J.K. Analyses of interfacial reactions at different levels of interconnection. Mater. Sci. Semicon. Proces. 2004, 7, 307-317.
12. Chen, W.T.; Ho, C.E.; Kao, C.R. Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders. J. Mater. Res. 2002, 17, 263-266.
13. Ho, C.E.; Tsai, R.Y.; Lin, Y.L.; Kao, C.R. Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni. J. Electr. Mater. 2002, 31, 584-590.
14. Wu, P.L.; Huang, M.K.; Lee, C.; Tzan, S.R. Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J leads/Sn-Ag-Cu interfaces. J. Electr. Mater. 2004, 33, 157-161.
15. Tsai, J.Y.; Hu, Y.C.; Tsai, C.M.; Kao, C.R.A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni. J. Electr. Mater. 2003, 32, 1203-1208.
16. Ho, C.E.; Lin, Y.L.; Yang, S.C.; Kao, C.R.; Jiang, D.S. Effects of limited Cu supply on soldering reactions between SnAgCu and Ni. J. Electr. Mater. 2006, 35, 1017-1024.
17. Ho, C.E.; Lin, Y.L.; Yang, S.C.; Kao, C.R. Volume effect on the soldering reaction between SnAgCu solders and Ni. In Proceedings of 10th International Symposium on Advanced Packaging Materials, Irvine, CA, USA, March 16-18, 2005.
18. Luo, W.C.; Ho, C.E.; Tsai, J.Y.; Lin, Y.L.; Kao, C.R. Solid-state reactions between Ni and Sn- Ag-Cu solders with different Cu concentrations". Mater. Sci. Eng. A 2005, 396, 385-391.
19. Alajoki, M.; Nguyen, L.; Kivilahti, J.K. Drop test reliability of wafer level chip scale packages. In Proceedings of The Electronic Component and Technology Conference (ECTĆ05), Orlando, FL, USA, May 31- June 3, 2005; pp. 637-643.
20. Minor, A.; Morris, J. Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging. Metall. Mater. Trans. 2000, 31A, 798-800.
21. Ho, C.; Shiau, L.; Kao, C. Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints. J. Electr. Mater. 2002, 31, 1264-1269.
22. Shiau, L.; Ho, C.; Kao, C. Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages. Solder. Surf. Mt. Tech. 2002, 14, 25-29.
23. Glazer, J. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review. J. Electr. Mater. 1994, 23, 693-700.
24. Laurila, T.; Vuorinen, V.; Mattila, T.; Kivilahti, J.K. Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders. J. Electr. Mater. 2005, 34, 103-111.
25. Suganuma, K.; Kim, K.S. Sn-Zn low temperature solder". J. Mater. Sci.: Mater. Electron. 2007, 18, 121-127.
26. Lin, H.J.; Chuang, T.H. Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads. J. Electron. Mater. 2006, 35, 154-164.
27. Chang, S.C.; Lin, S.C.; Hsieh, K.C. Phase reaction in Sn-9Zn solder with Ni/Au surface finish bond-pad at 175°C ageing. J. All. Comp. 2007, 428, 179-184.
28. Laurila, T.; Vuorinen, V.; Paulasto-Kröckel, M.; Dinsdale, A. Impurity and Alloying Effects on Interfacial Reaction Layers in Lead-Free Soldering. Mater. Sci. Eng. R in press.
29. Laurila, T.; Molarius, J. Reactive phase formation in thin film metal/metal and metal/silicon diffusion couples. Cri. Rev. Solid State Mater. Sci. 2003, 28, 185-230.
30. Mattila, T.T.; Vuorinen, V.; Kivilahti, J.K. Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections. J. Mater. Res. 2004, 19, 3214-3223.
31. Yoon, J.W.; Kim, S.W.; Jung, S.B. Effect of reflow time on interfacial reaction and shear strength of Sn-0.7Cu solder/Cu and electroless Ni-P BGA joints. J. All. Comp. 2004, 385, 192-198.
32. Hang, S.J.; Kao, H.J.; Liu, C.Y. Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps. J. Electr. Mater. 2004, 33, 1130-1136.
33. Kim, S.W.; Yoon, J.W.; Jung, S.B. Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization. J. Electr. Mater. 2004, 33, 1182-1189.
34. He, M.; Chen, Z.; Qi, G. Solid state interfacial reaction of Sn-37Pb and Sn-3.5Ag solders with Ni-P under bump metallization. Acta Materialia 2004, 52, 2047-2056.
35. He, M.; Chen, Z.; Qi, G.; Wong, C.C.; Mhaisalkar, S.G. Effect of post-reflow cooling rate on intermetallic compound formation between Sn-3.5 Ag solder and Ni-P under bump metallization. Thin Solid Films 2004, 462-463, 363-369.
36. He, M.; Kumar, A.; Yeo, P.T.; Qi, G.J.; Chen, Z. Interfacial reaction between Sn-rich solders and Ni-based metallization. Thin Solid Films 2004, 462-463, 387-394.
37. Alam, M.O.; Chan, Y.C.; Tu, K.N. Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad. J. Appl. Phys. 2003, 94, 4108-4115.
38. Young, B.L.; Duh, J.G.; Jang, G.Y. Compound formation for electroplated Ni and electroless Ni in the under-bump metallurgy with Sn-58Bi solder during aging. J. Electr. Mater. 2003, 32, 1463-1473.
39. Alam, M.O.; Chan, Y.C.; Hung, K.C. Reliability study of the electroless Ni-P layer against solder alloy. Microelectron. Reliab. 2002, 42, 1065-1073.
40. Jeon, Y.D.; Paik, K.W.; Bok, K.S.; Choi, W.S.; Cho, C.L. Studies of electroless nickel under bump metallurgy-Solder interfacial reactions and their effects on flip chip solder joint reliability. J. Electr. Mater. 2002, 31, 520-528.
41. Liu, P.L.; Shang, J.K. Thermal stability of electroless-nickel/solder interface: Part A. Interfacial chemistry and microstructure. Metal. Mater. Trans. A 2000, 31A, 2857-2866.
42. Jang, J.W.; Kim, P.G.; Tu, K.N.; Frear, D.R.; Thompson, P. Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology. J. Appl. Phys. 1999, 85, 8456-8463.
43. Erich, R.; Coyle, R.J.; Wenger, G.M.; Primavera, A. Shear testing and failure mode analysis for evaluation of BGA ball attachment. In Proc. 24th IEEE/CPMT Inter. Electronics Manufacturing Technology Symp., Austin, TX, USA, October 18-19, 1999; pp. 16-22.
44. Hung, S.C.; Zheng, P.J.; Lee, S.C.; Lee, J.J. The effect of Au plating thickness of BGA substrates on ball shearstrength under reliability tests. In Proc. 24th IEEE/CPMT Inter. Electronics Manufacturing Technology Symp., Austin, TX, USA, October 18-19, 1999; pp. 7-15.
45. Zribi, A.; Chromik, R.R.; Presthus, R.; Clum, J.; Teed, K., Zavalij, L.; DeVita, J.; Tova, J.; Cotts, E.J. Solder metallization interdiffusion in microelectronic interconnects. In Proc. 49th Electronic Components and Technology Conference, San Diego, CA, USA, June 1-4, 1999; pp. 451-457.
46. Hwang, C.W.; Suganuma, K.; Kiso, M.; Hashimoto, S. Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders. J. Mater. Res. 2003, 18, 2540-2543.
47. Oberndorff, P. Lead-Free Solder Systems: Phase Relations and Microstructures. Doctoral Thesis, Eindhoven University of Technology: Eindhoven, The Netherlands, 2001.
48. Lin, C.H.; Chen, S.W.; Wang, C.H. Phase equilibria and solidification properties of Sn-Cu-Ni alloys. J. Electr. Mater. 2002, 31, 907-915.
49. Schmetterer, C.; Flandorfer, H.; Luef, Ch.; Kodentsov, A.; Ipser, H. Cu-Ni-Sn: A Key System for Lead-Free Soldering. J. Electr., Mater. 2009, 38, 10-24.
50. Matsuki, H.; Ibuka, H.; Saka, H. TEM observation of interfaces in a solder joint in a semiconductor device. Sci. Tech. Adv. Mater. 2002, 3, 261-270.
51. Jeon, Y.D.; Paik, K.W.; Bok, K.S.; Choi, W.S.; Cho, C.L. Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-Solder interface and their effects on flip chip solder joint reliability. In Proc. 51st Electronic Components and Technology Conference, 2001, Florida, Orlando, USA, May 29-June 1, 2001; pp. 1362-1370
52. Ganesan, R.; Ipser, H. Vapor pressure measurements in the systems Ni-P and Sn-P. In COST MP 0602 Midterm meeting, Bochum, Germany, April 15-17, 2009.
53. Massalski, T. Binary Alloy Phase Diagrams; ASM: Ohio, USA, 1996.
54. IPMA. The Thermodynamic Databank for Interconnection and Packaging Materials. Helsinki University of Technology: Helsinki, Finland, 2009.
55. Schmetterer, C.; Kodentsov, A.; Ipser, H. The Ni-P-Sn phase diagram. In COST MP 0602 Midterm Meeting, Bochum, Germany, April 15-17, 2009.
56. Johnson, W.J. Thermodynamic and kinetic aspects of the crystal to glass transformation in metallic materials. Prog. Mater. Sci., 1986, 30, 81-134.
57. Nicolet, M.A. Diffusion in Amorphous Materials; Jain, H., Gupta, D., Eds.; TMS: Warrendale, PA, USA, 1994; p. 225.
58. Zeng, K.; Tu, K.N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. R 2002, R38, 55-105.
59. Guy, A. Elements of Physical Chemistry. Addison Wesley: New York, NY, USA, 1960.
60. Anhock, S.; Oppermann, H.; Kallmayer, C.; Aschenbrenner, R.; Thoman, L.; Reichel, H. Investigations of Au-Sn alloys on different end-metallizations for high temperature applications. In 22nd IEEE/CPMT International Electronics Manufacturing Technology Symposium, Berlin, Germany, April 27-29, 1998; 156-165.
61. Zavalij, L.; Zribi, A.; Chromik, R.; Pitely, S.; Zavalij, P.; Cotts, E. Crystal structure of Au1-xNixSn4 intermetallic alloys. J. All. Comp. 2002, 334, 79-85.
62. Vuorinen, V.; Laurila, T.; Mattila, T.; Heikinheimo, E; Kivilahti, J.K. Solid state reactions between Cu(Ni) alloys and Sn. J. Electron. Mater. 2007, 36, 1355-1362.
63. Roeder, J. Phase Equilibria and Compound Formation in the Au-Cu-Sn System at Low Temperature. Doctoral Dissertation, Lehigh University: Bethlehem, PA, USA, 1988.
64. Buene, L.; Falkenberg-Arell, H.; Gjonnes, J.; Tafto, J.A Study of Evaporated Gold-Tin Films Using Transmission Electron Microscopy.-II. Thin Solid Films 1980, 67, 95-102.
65. Dyson, B. Diffusion of gold and silver in tin single crystals. J. Appl. Phys. 1966, 37, 2375-2377.
66. Kidson, C. The diffusion of gold in lead single crystals. Phil. Mag., 1966, 13, 247-266.
67. Lee, C.Y.; Yoon, J.W.; Kim, Y.J.; Jung, S-B. Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate. Microelectr. Eng. 2005, 82, 561-568.
68. Kim, K.S; Yang, J.M; Yu, C.H.; Jung, I.O.; Kim, H.H. Analysis of Interfacial Reactions Between Sn-Zn Solders and the Au/Ni Electrolytic-Plated Cu Pad. J. All. Comp. 2004, 379, 314-318.
69. Liou, W.K; Yen, Y.W. Phase equilibria of the Au-Sn-Zn ternary system and interfacial reactions in the Sn-Zn/Au couples. Intermetallics 2009, 17, 72-78.
70. Lin, H.J.; Chuang, T.H. Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads. J. Electr. Mater. 2006, 35, 154-164.
71. Liu, H.; Ishida, K.; Jin, Z.; Du, Y. Thermodynamic assessment of the Au-Zn binary system. Intermetallics 2003, 11, 987-994.
72. Okamoto, H. Ni-Zn. J. Phase Equil. 2003, 24, 280.
73. Chen, C.; Ho, C.; Lin, A.; Luo, G.; Kao, C.R. Long-term aging study on the solid-state reaction between 58Bi42Ni solder and Ni substrate. J. Electron. Mater. 2000, 29, 1200-1206.
74. Seo, S.K.; Cho, M.; Lee, H. Thermodynamic assessment of the Ni-Bi binary system and phase equilibria of the Sn-Bi-Ni ternary system. J. Electron. Mater. 2007, 36, 1536-1544.
75. Vassilev, G.; Lilova, K.; Gachon, J.C. Phase diagram investigations of the Ni-Sn-Bi system. J. Alloys Compound. 2009, 469, 264-269.
76. Rönkä, K.; van Loo, F.J.J.; Kivilahti, J.K. The local nominal composition-Useful Concept for microjoining and interconnection applications. Scr. Mater. 1997, 37, 1575-1581.