Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Journal of Applied Physics

Volumn 97, Issue 2, 2005, Pages

  Zeng, Kejun ^a   Stierman, Roger ^a   Chiu, Tz Cheng ^a   Edwards, Darvin ^a   Ano, Kazuaki ^b   Tu, K N ^c  

^a TEXAS INSTRUMENTS   (United States)

^b Texas Instruments Japan Ltd   (Japan)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FOCUSED ION BEAMS (FIB); GROWTH MECHANISMS; KIRKENDALL VOIDS; VOID FORMATION;

COPPER; CRACKS; DIFFUSION; ELECTRODEPOSITION; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; ION BEAMS; LAMINATES; METALLIZING; MICROSTRUCTURE; NICKEL PLATING; SOLDERING; TIN COMPOUNDS;

SOLDERED JOINTS;

EID: 19944432174     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1839637     Document Type: Article

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