The 260 °C phase equilibria of the Sn-Sb-Cu ternary system and interfacial reactions at the Sn-Sb/Cu joints

Intermetallics

Volumn 15, Issue 8, 2007, Pages 1027-1037

  Lee, Chiapyng ^a   Lin, Chung Yung ^a   Yen, Yee Wen ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

A. Intermetallics, miscellaneous; A. Ternary alloy systems; B. Phase diagrams; F. Electron microprobe

Indexed keywords

ADDITION REACTIONS; INTERMETALLICS; PHASE DIAGRAMS; PHASE EQUILIBRIA; SOLID SOLUTIONS; SOLUBILITY; STOICHIOMETRY;

ELECTRON MICROPROBES; ISOTHERMAL SECTIONS; TERNARY ALLOY SYSTEMS;

TERNARY ALLOYS;

EID: 34250008993     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2006.12.002     Document Type: Article

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