Effect of post-reflow cooling rate on intermetallic compound formation between Sn-3.5 Ag solder and Ni-P under bump metallization

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 363-369

  He, Min ^a   Chen, Zhong ^a   Qi, Guojun ^b   Wong, C C ^a   Mhaisalkar, S G ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Electroless nickel; Intermetallic compound; Lead free solder; Reflow

Indexed keywords

COOLING RATES; UNDER BUMP METALLIZATION (UBM);

COOLING; METALLIZING; NICKEL; SILVER; SOLDERING; SUBSTRATES; TIN;

INTERMETALLICS;

EID: 4344669309     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.045     Document Type: Article

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