Analytical derivation of the self-alignment motion of flip chip soldered components

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 2, 1999, Pages 116-121

  van Veen, N ^a  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MATHEMATICAL MODELS; SOLDERED JOINTS;

DAMPING FACTOR; LIQUID SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 0032624354     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792665     Document Type: Article

References (9)

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2. Bingzhi, S., Gershovich, M., and Lee, Y.C., 1997, “Gas Flow Effects on Precision Solder Self-Alignment,” Proceedings, ECTC 1997, p. 797.
3. Bird, R.B., Armstrong, R.C., and Nassager, O., 1977, Dynamics of Polymeric Liquids, Vol. 1, John Wiley, New York, pp. 19-21.
4. Dijksman, F., 1997, private communication.
5. Goldmann, L.S., 1993; “A Heuristic Force-Height Equation for Molten Axi-Symmetric Solder Joints,” Proceedings, ECTC 43, p. 1120.
6. Landry, M., Patra, S.K., and Lee, Y.C., 1991, Manufacturing Processes and Materials Challenges in Microelectronics Packaging, AMD-Vol. 131/EEP-Vol. 1, ASME, New York.
7. Lin, W., Patra, S.K., and Lee, Y.C., 1995, “Design of Solder Joints for SelfAligned Opto-Electronic Assembly,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, Vol. 18, No. 3.
8. Morse, P.M., 1929, “Diatomic Molecules According to the Wave Mechanics: II—Vibrational Levels,” Phys. Rev. 34, p. 57.
9. Veen, N.J.A., 1995, Proceedings, ITAP’95, San Jose, Vol. 5, p. 146.