Dry self-assembly & gang bonding of micro-components from silicon carrier to substrate wafer

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2006, Pages 486-491

  Ong, Y Y ^a   Lim, Y L ^a   Yan, L L ^a   Liao, E B ^a   Kripesh, V ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CIVIL AVIATION; NONMETALS; SELF ASSEMBLY; SILICON; SILICON WAFERS; TECHNOLOGY;

ELECTRONICS MANUFACTURING; EXTERNAL-; INTERNATIONAL CONFERENCES; MICRO-COMPONENTS; SELF- ASSEMBLIES; SELF-ASSEMBLY PROCESSES; SILICON CARRIERS; SUBSTRATE WAFERS;

WAFER BONDING;

EID: 50249179080     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2006.4456499     Document Type: Conference Paper

References (6)

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4. L. L. Yan, Y. L. Lim, E. B. Liao, V. Kripesh, " Directed Self-Assembly of Microchips by shape locking", in APCOT 2006, PAT-A0166
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