Preparation of macroporous metal films from colloidal crystals [14]

Journal of the American Chemical Society

Volumn 121, Issue 34, 1999, Pages 7957-7958

  Jiang, Peng ^a   Cizeron, Joel ^a   Bertone, Jane F ^a   Colvin, Vicki L ^a  

^a RICE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; GOLD; METAL; NICKEL; PLATINUM; SILICON DIOXIDE; SILVER;

CHEMICAL REACTION; COLLOID; CONTROLLED STUDY; CRYSTAL; LETTER; POROSITY; SYNTHESIS; X RAY DIFFRACTION;

EID: 0033198550     PISSN: 00027863     EISSN: None     Source Type: Journal    
DOI: 10.1021/ja991321h     Document Type: Letter

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23. Electroless plating of copper is performed at room temperature by the technique described by Kim el al. (Kim, E.; Xia, Y.; Whitesides, G. M. J. Am. Chem. Soc. 1996, 118, 5722). A Technic EN 9148 low phosphorus electroless nickel bath (Technic Inc., RI) is used (T = 87°C) to plate nickel. A commercial silvering bath (HE-300, Peacock Laboratories, Philadelphia, PA) is used to plate silver at room temperature. A commercial gold electroless plating solution (Oromerse SO, Technic Inc.) is used to plale gold (T = 70 °C). Electroless plating of platinum is performed at room temperature by the technique described by Rhoda et al. (Rhoda, R. N.; Suffern, N. Y.; Vines, R. F.; Chatham, N. J. U.S. patent 3, 486, 928, 1969).
24. Electroless plating of copper is performed at room temperature by the technique described by Kim el al. (Kim, E.; Xia, Y.; Whitesides, G. M. J. Am. Chem. Soc. 1996, 118, 5722). A Technic EN 9148 low phosphorus electroless nickel bath (Technic Inc., RI) is used (T = 87°C) to plate nickel. A commercial silvering bath (HE-300, Peacock Laboratories, Philadelphia, PA) is used to plate silver at room temperature. A commercial gold electroless plating solution (Oromerse SO, Technic Inc.) is used to plale gold (T = 70 °C). Electroless plating of platinum is performed at room temperature by the technique described by Rhoda et al. (Rhoda, R. N.; Suffern, N. Y.; Vines, R. F.; Chatham, N. J. U.S. patent 3, 486, 928, 1969).
25. Surface areas are calculated by assuming spherical air voids (215 nm diameter) fill 74% of the volume of the metal. No attempt is made to correct for the loss of surface area caused by the interconnections between pores, or for the enhancement of surface area due to surface roughness.