Surface tension powered self-assembly of 3-D micro-optomechanical structures

Journal of Microelectromechanical Systems

Volumn 8, Issue 4, 1999, Pages 448-455

  Syms, Richard R A ^a  

^a IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

MELTING; MICROMACHINING; MIRRORS; PHOTORESISTS; SCANNING; SILICON ON INSULATOR TECHNOLOGY; SURFACE TENSION;

THREE-DIMENSIONAL MICROOPTOMECHANICAL STRUCTURES;

MICROELECTROMECHANICAL DEVICES;

EID: 0033309887     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.809060     Document Type: Article

References (38)

1. K. Suzuki, I. Shimoyama, H. Miura, and Y. Ezura, "Creation of an insect-based microrobot with an external skeleton and elastic joints," in Proc. Micro Electro Mechanical Systems '92, Travemunde, Germany, Feb. 4-7, 1992, pp. 190-195.
2. K. Suzuki, I. Shimoyama, and H. Miura, "Insect model based microrobot with elastic hinges" J. Microelectromech. Syst., vol. 3, pp. 4-9, 1994.
3. M. G. Allen, M. Scheidl, and R. L. Smith, "Design and fabrication of movable silicon plates suspended by flexible supports," in Proc. IEEE Microelectromechanical Syst. Workshop, Feb. 1989, pp. 76-81.
4. _, "Movable micromachined silicon plates with integrated position sensing" Sens. Actuators, vols. A21-23, pp. 211-214, 1990.
5. L. S. Fan , Y.-C. Tai, R. S. Muller, "Integrated movable micromechanical structures for sensors and actuators," IEEE Trans. Electron Devices, vol. 35, pp. 724-730, 1988.
6. K. S. Pister, M. W. Judy, S. R. Burgen, and R. S. Fearing, "Microfabricated hinges," Sens. Actuators, vol. A33, pp. 249-256, 1992.
7. I. Shimoyama, O. Kano, and H. Miura, "3D microstructures folded by Lorentz force," in Proc. 11th Int. Workshop MicroElectroMechanical Systems, Heidelberg, Germany, Jan 25-29, 1998, pp. 24-28.
8. T. Ebefors, E. Kälvesten, and G. Stemme, "New small radius joints based on thermal shrinkage of polyimide in V-grooves for robust self-assembly 3D microstructures," J. Micromech. Microeng., vol. 8, pp. 188-194, 1988.
9. E. Smela, O. Inganä, and I. Lundströ, "Self-opening and closing boxes and other micromachined folding structures," in Proc. 8th Int. Conf. on Solid-State Sensors and Actuators, Stockholm, Sweden, pp. 350-351. June 25-29, 1995.
10. _, "Controlled folding of micrometer-size structures" Science, vol. 268, pp. 1735-1738, 1995.
11. N. J. Daneman, N. C. Tien, O. Solgaard, A. P. Pisano, K. Y. Lau, and R. S. Muller, "Linear vibromotor for positioning optical components," J. Microelectromech Syst., vol. 5, pp. 159-165, 1996.
12. N. C. Tien, O. Solgaard, M. H. Kiang, M. Daneman, K. Y. Lau, and R. S. Muller, "Surface micromachined mirrors for laser-beam positioning" Sens. Actuators, vol. A52, pp. 76-80, 1996.
13. E. J. Garcia and J. J. Sniegowski, "Surface micromachined microengine," Sens. Actuators, vol. A48, pp. 203-214, 1995.
14. E. J. Garcia, "Micro-flex mirror and instability actuation technique," in Proc. 11th Int. Workshop MicroElectro Mechanical Systems, Heidelberg, Germany, Jan 25-29, 1998, pp. 470-475.
15. L. Y. Lin, S. S. Lee, K. S. J. Pister, and M. C. Wu, "Micromachined micro-optical bench for optoelectronic packaging," in Proc. 7th Annual Meet. IEEE Lasers and Electro-Optics Soc., Boston, MA, Oct. 31-Nov. 3, 1994, pp. 219-220.
16. _, "Three-dimensional micro-Fresnel optical elements fabricated by micromachining techniques," Electron. Lett., vol. 30, pp. 448-449, 1994.
17. S. S. Lee, L. Y. Lin, K. S. J. Pister, M. C. Wu, H. C. Lee, and P. Grodzinski, "Passively aligned hybrid integration of 8 × 1 micromachined micro-Fresnel lens arrays and 8 × 1 vertical-cavity surface-emitting laser arrays for free-space optical interconnect," IEEE Photon. Technol. Lett., vol. 7, pp. 1031-1033, 1995.
18. M. C. Wu, L.-Y. Lin, S.-S. Lee, and K. S. J. Pister, "Micromachined free-space integrated micro-optics," Sens. Actuators, vol. A50, pp. 127-134, 1995.
19. C. R. King C.R., L. Y. Lin, M. C. Wu, "Out-of-plane refractive microlens fabricated by surface micromachining," IEEE Photon. Technol. Lett., vol. 8, pp. 1349-1351, 1996.
20. J. L. Shen, L. Y. Lin, S. S. Lee, M. C. Wu, and M. Sergent, "Surface-micromachined tunable three-dimensional solid Fabry-Perot etalons with dielectric coatings," Electron. Lett., vol. 31, pp. 2172-2173, 1995.
21. L. Y. Lin, J. L. Shen, M. C. Wu, and A. M. Segent, "Tunable three-dimensional solid Fabry-Perot etalons fabricated by surface micromachining," IEEE Photon. Technol. Lett., vol. 8, pp. 101-103, 1996.
22. M.-H. Kiang, O. Solgaard, R. S. Muller, and K. Y. Lau, "Micromachined polysilicon microscanners for barcode readers," IEEE Photon. Technol. Lett., vol. 8, pp. 95-97, 1996.
23. M.-H. Kiang, O. Solgaard, and K. Y. Lau, "Electrostatic combdrive-actuated micromirrors for laser-beam scanning and positioning," J. Micromech. Syst., vol. 7, pp. 27-37, 1998.
24. J. R. Reid, V. M. Bright, and J. H. Comtois, "Arrays of thermal microactuators coupled to micro-optical components," in Proc. SPIE, 1996, vol. 2865, pp. 74-82.
25. J. T. Butler, V. M. Bright, and J. R. Reid, "Scanning and rotating micromirrors using thermal actuators" in Proc. SPIE, 1997, vol. 3131, pp. 134-144.
26. T. Ebefors, E. Kälvesten, and G. Stemme, "Dynamic actuation of polyimide V-groove joints by electrical heating," Sens. Actuators, vol. A67, pp. 199-204, 1998.
27. M. C. Wu, "Micromachining for optical and optoelectronic systems." Proc. IEEE, vol. 85, pp. 1833-1856, 1997.
28. R. R. A. Syms and E. M. Yeatman, "Self-assembly of fully three-dimensional microstructures using rotation by surface tension forces," Electron. Lett., vol. 29, pp. 662-664, 1993.
29. R. R. A. Syms, "Equilibrium of hinged and hingeless structures rotated using surface tension forces," J. Microelectromech. Syst., vol. 4, pp. 177-184, 1995.
30. K. F. Harsh, R. S. Irwin, and Y. C. Lee, "Solder self-assembly for MEMS," in Proc. 4th Int. Instrumentation Symp., Reno, NV, May 3-7, 1998, pp. 256-261.
31. K. Harsh and Y. C. Lee, "Modeling for solder self-assembled MEMS," in Proc. SPIE, vol. 3289, San Jose, CA, Jan. 24-30, 1998, pp. 177-184.
32. P. W. Green, R. R. A. Syms, and E. M. Yeatman, "Demonstration of three-dimensional microstructure self-assembly," J. Microelectromech. Syst., vol. 4, pp. 170-176, 1995.
33. R. R. A. Syms, "Rotational self-assembly of complex microstructures by the surface tension of glass," Sens. Actuators, vol. A65, pp. 238-243, 1998.
34. A. Benitez, J. Esteve, and J. Bausells, "Bulk silicon microelectromechanical devices fabricated from commercial bonded and etched-back silicon-on-insulator substrates," Sens. Actuators, vol. A50, pp. 99-103, 1995.
35. E. H. Klaassen, K. Petersen, J. M. Noworolski, J. Logan, N. I. Maluf, J. Brown, C. Storment, W. McCulley, and T. A. Kovacs, "Silicon fusion bonding and deep reactive ion etching: A new technology for microstructures," Sens. Actuators, vol. A52, pp. 132-139, 1996.
36. R. Yeh, E. J. J. Kruglick, and K. S. J. Pister, "Surface-micromachined components for articulated microrobots," J. Microelectromech. Syst., vol. 5, pp. 10-17, 1996.
37. A. Friedberger and R. S. Müller, "Improved surface-micromachined hinges for fold-out structures," J. Microelectromech. Syst., vol. 7, pp. 315-319, 1998.
38. J. K. Bhardwaj and H. Ashraf, "Advanced silicon etching using high density plasmas," in Proc. SPIE, vol. 2639, pp. 224-233, 1995.