-
1
-
-
0026368757
-
The integration of micro-machine fabrication with electronic device fabrication on III-V semiconductor materials
-
R. H. Hackett, L. E. Larson, and M. Melendes, "The integration of micro-machine fabrication with electronic device fabrication on III-V semiconductor materials," in Proc. Transducers '91, 1991 International Conference on Solid-State Sensors and Actuators, IEEE, New York, NY, 1991, pp. 51-54.
-
Proc. Transducers '91, 1991 International Conference on Solid-State Sensors and Actuators, IEEE, New York, NY, 1991
, pp. 51-54
-
-
Hackett, R.H.1
Larson, L.E.2
Melendes, M.3
-
2
-
-
0004141416
-
Micromechanical signal processors
-
Ph.D., University of California at Berkeley
-
C. T.-C. Nguyen, "Micromechanical Signal Processors," Ph.D., University of California at Berkeley, 1994.
-
(1994)
-
-
Nguyen, C.T.-C.1
-
4
-
-
0003094740
-
Fully-integrated low phase noise bipolar differential VCO's at 2.9 and 4.4 GHz
-
A. M. Niknejad, R. G. Meyer, and J. L. Tham, "Fully-Integrated low phase noise bipolar differential VCO's at 2.9 and 4.4 GHz," in Proc. 25th European Solid-State Circuits Conference ESSCIRC'99, Editions Frontieres, Neuily sur Seine, France, 1999, pp. 198-201.
-
Proc. 25th European Solid-State Circuits Conference ESSCIRC'99, Editions Frontieres, Neuily sur Seine, France, 1999
, pp. 198-201
-
-
Niknejad, A.M.1
Meyer, R.G.2
Tham, J.L.3
-
5
-
-
0031223991
-
High frequency multilayer chip inductors
-
Sept.
-
J.-Y. Hsu, H.-C. Lin, H.-D. Shen, and C.-J. Chen, "High frequency multilayer chip inductors," IEEE Trans. Magnetics, vol. 33-5, Sept. 1997.
-
(1997)
IEEE Trans. Magnetics
, vol.33
, Issue.5
-
-
Hsu, J.-Y.1
Lin, H.-C.2
Shen, H.-D.3
Chen, C.-J.4
-
6
-
-
0033336357
-
A DC/DC boost converter toward fully on-chip integration using new micromachined planar inductors
-
IEEE, Piscataway, NJ, Apr.
-
S. Iyengar, T. M. Liakopoulos, and C. H. Ahn, "A DC/DC boost converter toward fully on-chip integration using new micromachined planar inductors," in Proc. 30th Annual IEEE Power Electronics Specialists Conference, vol. 1, IEEE, Piscataway, NJ, Apr. 1999, pp. 72-76.
-
(1999)
Proc. 30th Annual IEEE Power Electronics Specialists Conference
, vol.1
, pp. 72-76
-
-
Iyengar, S.1
Liakopoulos, T.M.2
Ahn, C.H.3
-
7
-
-
0034427508
-
On-chip spiral inductors suspended over deep copper-lined cavities
-
Dec.
-
H. Jiang, Y. Wang, J.-L. A. Yey, and N. C. Tien, "On-chip spiral inductors suspended over deep copper-lined cavities," IEEE Trans. Microw. Theory Tech., vol. 48-12, Dec. 2000.
-
(2000)
IEEE Trans. Microw. Theory Tech.
, vol.48
, Issue.12
-
-
Jiang, H.1
Wang, Y.2
Yey, J.-L.A.3
Tien, N.C.4
-
8
-
-
0030418501
-
Accurate design of inductors on multi-chip module using high-resistivity silicon substrate
-
J. Lin, L. Zu, R. C. Frye, K. L. Tai, M. Y. Lau, D. Kossives, F. Hrycenko, and Y.-K. Chen, "Accurate design of inductors on multi-chip module using high-resistivity silicon substrate," in Proc. Electrical Performance of Electronic Packaging, IEEE, New York, NY, 1996, pp. 187-189.
-
Proc. Electrical Performance of Electronic Packaging, IEEE, New York, NY, 1996
, pp. 187-189
-
-
Lin, J.1
Zu, L.2
Frye, R.C.3
Tai, K.L.4
Lau, M.Y.5
Kossives, D.6
Hrycenko, F.7
Chen, Y.-K.8
-
9
-
-
0032186601
-
Analysis, design, and optimization of spiral inductors and transformers for Si RF IC's
-
Oct.
-
A. M. Niknejad and R. G. Meyer, "Analysis, design, and optimization of spiral inductors and transformers for Si RF IC's," IEEE J. Solid-State Circuits, vol. 33-10, Oct. 1998.
-
(1998)
IEEE J. Solid-State Circuits
, vol.33
, Issue.10
-
-
Niknejad, A.M.1
Meyer, R.G.2
-
10
-
-
0032636728
-
An investigation of on-chip spiral inductors on a 0.6 μm BiCMOS technology for RF applications
-
Mar.
-
J. A. Power, S. C. Kelly, E. C. Kelly, E. C. Griffith, and M. O'Neill, "An investigation of on-chip spiral inductors on a 0.6 μm BiCMOS technology for RF applications," in Proc. IEEE Int. Conf. on Microelectronics Test Structures, vol. 12, Mar. 1999.
-
(1999)
Proc. IEEE Int. Conf. on Microelectronics Test Structures
, vol.12
-
-
Power, J.A.1
Kelly, S.C.2
Kelly, E.C.3
Griffith, E.C.4
O'Neill, M.5
-
11
-
-
0034868047
-
A new approach to characterize substrate losses of on-chip inductors
-
Mar.
-
K. Schimpf, B. Benna, and D. Proetel, "A new approach to characterize substrate losses of on-chip inductors," in Proc. IEEE Int. Conference on Microelectronic Test Structures, vol. 14, Mar. 2001.
-
(2001)
Proc. IEEE Int. Conference on Microelectronic Test Structures
, vol.14
-
-
Schimpf, K.1
Benna, B.2
Proetel, D.3
-
12
-
-
0033365516
-
High-performance three-dimensional on-chip inductors fabricated by novel micromachining technology for RF MMIC
-
Piscataway, NJ, USA
-
Y.-B. Yoon, C.-H. Han, E. Yoon, and C.-K. Kim, "High-performance three-dimensional on-chip inductors fabricated by novel micromachining technology for RF MMIC," in Proc. 1999 IEEE MTT-S International Microwave Symposium Digest, IEEE, vol. 4, Piscataway, NJ, USA, 1999, pp. 1523-1526.
-
(1999)
Proc. 1999 IEEE MTT-S International Microwave Symposium Digest, IEEE
, vol.4
, pp. 1523-1526
-
-
Yoon, Y.-B.1
Han, C.-H.2
Yoon, E.3
Kim, C.-K.4
-
13
-
-
84886447973
-
Monolithic high-performance three-dimensional coil inductors for wireless communication applications
-
D. J. Young, V. Malba, J.-J. Ou, A. F. Bernhardt, and B. E. Boser, "Monolithic high-performance three-dimensional coil inductors for wireless communication applications," in Proc. Int. Electron Devices Meeting 1997, IEDM, New York, NY, USA, 1997, pp. 67-70.
-
Proc. Int. Electron Devices Meeting 1997, IEDM, New York, NY, USA, 1997
, pp. 67-70
-
-
Young, D.J.1
Malba, V.2
Ou, J.-J.3
Bernhardt, A.F.4
Boser, B.E.5
-
14
-
-
0032642374
-
Design strategy of on-chip inductors for highly integrated RF systems
-
C. P. Yue and S. S. Wong, "Design strategy of on-chip inductors for highly integrated RF systems," in Proc. 1999 Design Automation Conference, IEEE, ACM, Piscataway, NJ, 1999, pp. 982-987.
-
Proc. 1999 Design Automation Conference, IEEE, ACM, Piscataway, NJ, 1999
, pp. 982-987
-
-
Yue, C.P.1
Wong, S.S.2
-
15
-
-
1942508549
-
-
HFC0603 Series [Online]. Available: www.MNA.corp.com
-
-
-
-
16
-
-
1942508546
-
-
LLV0603FB [Online]. Available: www.tokoam.com
-
-
-
-
17
-
-
0012317243
-
Self-assembled out-of-plane high Q inductors
-
C. L. Chua, D. K. Fork, K. VanSchuylenbergh, and J.-P. Lu, "Self-assembled out-of-plane high Q inductors," in Proc. Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head Island, SC, June 2-6, 2002, pp. 372-373.
-
Proc. Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head Island, SC, June 2-6, 2002
, pp. 372-373
-
-
Chua, C.L.1
Fork, D.K.2
VanSchuylenbergh, K.3
Lu, J.-P.4
-
18
-
-
0038817621
-
RF MEMS based on epoxy-core conductors
-
Y.-K. Yoon, J.-W. Park, and M. G. Allen, "RF MEMS based on epoxy-core conductors," in Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head Island, SC, June 2-6, 2002, pp. 374-375.
-
Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head Island, SC, June 2-6, 2002
, pp. 374-375
-
-
Yoon, Y.-K.1
Park, J.-W.2
Allen, M.G.3
-
19
-
-
0033333103
-
Packaging-compatible high Q microinductors and microfilters for wireless applications
-
J. Y. Park and M. G. Allen, "Packaging-compatible high Q microinductors and microfilters for wireless applications," IEEE Trans. Adv. Packag., vol. 22, pp. 207-213, 1999.
-
(1999)
IEEE Trans. Adv. Packag.
, vol.22
, pp. 207-213
-
-
Park, J.Y.1
Allen, M.G.2
-
20
-
-
0033099111
-
A monolithic variable inductor network using microrelays with combined thermal and electrostatic actuation
-
S. F. Zhou, X. Q. Sun, and W. N. Carr, "A monolithic variable inductor network using microrelays with combined thermal and electrostatic actuation," J. Micromech. Microeng., vol. 9, pp. 45-50, 1999.
-
(1999)
J. Micromech. Microeng.
, vol.9
, pp. 45-50
-
-
Zhou, S.F.1
Sun, X.Q.2
Carr, W.N.3
-
21
-
-
0034274993
-
High Q microwave inductors on silicon by surface tension self-assembly
-
G. W. Dahlmann and E. M. Yeatman, "High Q microwave inductors on silicon by surface tension self-assembly," Electron. Lett., vol. 36, pp. 1707-1708, 2000.
-
(2000)
Electron. Lett.
, vol.36
, pp. 1707-1708
-
-
Dahlmann, G.W.1
Yeatman, E.M.2
-
22
-
-
17944394356
-
Fabrication, RF characteristics and mechanical stability of self-assembled 3D microwave inductors
-
G. W. Dahlmann, E. M. Yeatman, P. Young, I. D. Robertson, and S. Lucyszyn, "Fabrication, RF characteristics and mechanical stability of self-assembled 3D microwave inductors," Sens. Actuators, Phys. A., vol. A97-98, pp. 215-220, 2002.
-
(2002)
Sens. Actuators, Phys. A.
, vol.A97-98
, pp. 215-220
-
-
Dahlmann, G.W.1
Yeatman, E.M.2
Young, P.3
Robertson, I.D.4
Lucyszyn, S.5
-
23
-
-
0035278843
-
Microstructure to substrate self-assembly using capillary forces
-
March
-
U. Srinivasan, D. Liepmann, and R. T. Howe, "Microstructure to substrate self-assembly using capillary forces," J. Microelectromech. Syst., vol. 10-1, pp. 17-24, March 2001.
-
(2001)
J. Microelectromech. Syst.
, vol.10
, Issue.1
, pp. 17-24
-
-
Srinivasan, U.1
Liepmann, D.2
Howe, R.T.3
-
24
-
-
0034682874
-
Forming electrical networks in three dimensions by self-assembly
-
D. H. Gracias J. Tien, T. L. Breen, C. Hsu, and G. M. Whitesides, "Forming electrical networks in three dimensions by self-assembly," Science, vol. 289, pp. 1170-1172, 2000.
-
(2000)
Science
, vol.289
, pp. 1170-1172
-
-
Gracias, D.H.1
Tien, J.2
Breen, T.L.3
Hsu, C.4
Whitesides, G.M.5
-
25
-
-
79956011804
-
Biomimetic self-assembly of helical electrical circuits using orthogonal capillary interactions
-
D. H. Gracias, M. Boncheva, C. Omoregie, and G. M. Whitesides "Biomimetic self-assembly of helical electrical circuits using orthogonal capillary interactions," Appl. Phys. Lett., vol. 80, pp. 2802-2804, 2002.
-
(2002)
Appl. Phys. Lett.
, vol.80
, pp. 2802-2804
-
-
Gracias, D.H.1
Boncheva, M.2
Omoregie, C.3
Whitesides, G.M.4
-
26
-
-
0037066541
-
Fabrication of a cylindrical display by patterned assembly
-
H. O. Jacobs, A. R. Tao, A. Schwartz, D. H. Gracias, and G. M. Whitesides, "Fabrication of a cylindrical display by patterned assembly," Science, vol. 296, pp. 323-325, 2002.
-
(2002)
Science
, vol.296
, pp. 323-325
-
-
Jacobs, H.O.1
Tao, A.R.2
Schwartz, A.3
Gracias, D.H.4
Whitesides, G.M.5
-
27
-
-
0042388267
-
Surface tension self assembly of microstructures - The state of the art
-
R. R. A. Syms, E. M. Yeatman, V. M. Bright, and G. M. Whitesides, "Surface tension self assembly of microstructures - The state of the art," J. Microelectromech. Syst., vol. 12, pp. 387-417, 2003.
-
(2003)
J. Microelectromech. Syst.
, vol.12
, pp. 387-417
-
-
Syms, R.R.A.1
Yeatman, E.M.2
Bright, V.M.3
Whitesides, G.M.4
-
28
-
-
0028445213
-
Fluidic self-assembly for the integration of GaAs light emitting diodes on Si substrates
-
H. J. Yeh and J. S. Smith, "Fluidic self-assembly for the integration of GaAs light emitting diodes on Si substrates," IEEE Photon. Technol. Lett., vol. 6, pp. 706-708, 1994.
-
(1994)
IEEE Photon. Technol. Lett.
, vol.6
, pp. 706-708
-
-
Yeh, H.J.1
Smith, J.S.2
-
29
-
-
1942476448
-
-
Alien Technology [Online]. Available: http://alientechnology.com/technology/overview.html
-
-
-
-
30
-
-
0031146007
-
A 1.8-GHz low-phase-noise CMOS VCO using optimized hollow spiral inductors
-
J. Craninickx and M. Steyaert, "A 1.8-GHz low-phase-noise CMOS VCO using optimized hollow spiral inductors," IEEE J. Solid-State Circuits, vol. 32, pp. 736-745, 1997.
-
(1997)
IEEE J. Solid-State Circuits
, vol.32
, pp. 736-745
-
-
Craninickx, J.1
Steyaert, M.2
-
32
-
-
0032186601
-
Analysis, design, and optimization of spiral inductors and transformers for Si RF IC's
-
Oct.
-
A. M. Niknejad and R. G. Meyer, "Analysis, design, and optimization of spiral inductors and transformers for Si RF IC's," IEEE J. Solid-State Circuits, vol. 33-10, pp. 1470-1481, Oct. 1998.
-
(1998)
IEEE J. Solid-State Circuits
, vol.33
, Issue.10
, pp. 1470-1481
-
-
Niknejad, A.M.1
Meyer, R.G.2
-
33
-
-
0034427508
-
On-chip spiral inductors suspended over deep copper-lined cavities
-
Dec.
-
H. Jiang, Y. Wang, J.-L. A. Yey, and N. C. Thien, "On-chip spiral inductors suspended over deep copper-lined cavities," IEEE Trans. Microw. Theory Tech., vol. 48-12, pp. 2415-2423, Dec. 2000.
-
(2000)
IEEE Trans. Microw. Theory Tech.
, vol.48
, Issue.12
, pp. 2415-2423
-
-
Jiang, H.1
Wang, Y.2
Yey, J.-L.A.3
Thien, N.C.4
-
34
-
-
0032665526
-
Micro-actuator for tera-storage
-
T. Hirano, L.-S. Fan, T. Semba, W. Y. Lee, J. Hong, S. Pattanaik, P. Webb, W.-H. Juan, and S. Chan, "Micro-Actuator for tera-storage," in Proc. IEEE Int. MEMS 99 Conference, Twelfth IEEE Int. Conference on Micro Electro Mechanical Systems, Piscataway, NJ, USA, 1999, pp. 441-446.
-
Proc. IEEE Int. MEMS 99 Conference, Twelfth IEEE Int. Conference on Micro Electro Mechanical Systems, Piscataway, NJ, USA, 1999
, pp. 441-446
-
-
Hirano, T.1
Fan, L.-S.2
Semba, T.3
Lee, W.Y.4
Hong, J.5
Pattanaik, S.6
Webb, P.7
Juan, W.-H.8
Chan, S.9
-
35
-
-
1942540393
-
-
F.A. Lowenheim, Ed.; New York: John Wiley & Sons Inc.
-
F.A. Lowenheim, Ed., Modern Electroplating, 3rd ed. New York: John Wiley & Sons Inc., 1974, pp. 183-203.
-
(1974)
Modern Electroplating, 3rd Ed.
, pp. 183-203
-
-
-
36
-
-
1942508548
-
High aspect ratio etching in polymer for microactuator applications
-
W. Lee, J. Gao, T. Hirano, S. Chan, and L.-S. Fan, "High aspect ratio etching in polymer for microactuator applications," in Proc. SPIE, The International Society for Optical Engineering, vol. 3223, 1997, pp. 110-117.
-
(1997)
Proc. SPIE, The International Society for Optical Engineering
, vol.3223
, pp. 110-117
-
-
Lee, W.1
Gao, J.2
Hirano, T.3
Chan, S.4
Fan, L.-S.5
|