Wafer-level packaging based on uniquely orienting self-assembly (the DUO-SPASS processes)

Journal of Microelectromechanical Systems

Volumn 15, Issue 3, 2006, Pages 531-540

  Fang, Jiandong ^a   Böhringer, Karl F ^a  

^a University of Washington   (United States)

Author keywords

Self organizing parallel assembly (SPASS) process; Two stage shape recognition; Uniquely orienting self assembly; Wafer level packaging

Indexed keywords

INTERFACES (MATERIALS); MICROPROCESSOR CHIPS; SELF ASSEMBLY; SILICON WAFERS;

SELF-ORGANIZING PARALLEL ASSEMBLY (SPASS) PROCESS; TWO-STAGE SHAPE RECOGNITION; UNIQUELY ORIENTING SELF-ASSEMBLY; WAFER-LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 33745137101     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2006.876790     Document Type: Article

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