Fluidic heterogeneous microsystems assembly and packaging

Journal of Microelectromechanical Systems

Volumn 15, Issue 4, 2006, Pages 864-870

  Zheng, Wei ^a   Chung, Jaehoon ^a   Jacobs, Heiko O ^a  

^a University of Minnesota   (United States)

Author keywords

Heterogeneous integration; Sensor systems; Sequential self assembly; Solder and shape directed self assembly

Indexed keywords

ELECTRONICS PACKAGING; ENCAPSULATION; LIGHT EMITTING DIODES; PATTERN RECOGNITION; SEMICONDUCTOR DEVICE MANUFACTURE;

GEOMETRICAL SHAPE RECOGNITION; HETEROGENEOUS INTEGRATION; SEQUENTIAL SELF-ASSEMBLY;

SELF ASSEMBLY;

EID: 33747431241     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2006.878885     Document Type: Article

References (18)

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