Fabrication of multicomponent microsystems by directed three-dimensional self-assembly

Advanced Functional Materials

Volumn 15, Issue 5, 2005, Pages 732-738

  Zheng, Wei ^a   Jacobs, Heiko O ^a  

^a University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CMOS INTEGRATED CIRCUITS; ETCHING; FABRICATION; MATHEMATICAL MODELS; PARAMETER ESTIMATION; PHOTORESISTS; SILICON WAFERS; SOLDERING; STATISTICAL METHODS; SURFACE CHEMISTRY;

BATCH TRANSFER; MULTICOMPONENT MICROSYSTEMS; PROCESS PARAMETERS; SILICON CARRIERS;

SELF ASSEMBLY;

EID: 18744382529     PISSN: 1616301X     EISSN: None     Source Type: Journal    
DOI: 10.1002/adfm.200400595     Document Type: Article

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