Parallel microassembly with electrostatic force fields

Proceedings - IEEE International Conference on Robotics and Automation

Volumn 2, Issue , 1998, Pages 1204-1211

  Bohringer K F ^a   Goldberg, K ^a   Cohn, M ^a   Howe, R ^a   Pisano, A ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTROSTATIC DEVICES; FRICTION; ROBOTICS; ULTRASONIC EFFECTS; ULTRASONIC WAVES; ADHESION; ALIGNMENT; ELECTRIC FIELDS; ULTRASONICS; VIBRATIONS (MECHANICAL);

ADHESIVE FORCE; ELECTROSTATIC FORCE FIELDS; FRICTIONAL PROPERTIES; MICRO ASSEMBLY; NEW APPROACHES; SPATIAL DENSITIES; SYSTEMATIC METHOD; ULTRASONIC VIBRATION;

ELECTROSTATIC FORCE; ROBOTIC ASSEMBLY;

ELECTROSTATIC FORCE FIELDS; PARALLEL MICROASSEMBLY;

EID: 0031635450     PISSN: 10504729     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ROBOT.1998.677259     Document Type: Conference Paper

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