Study of micro-scale limits of solder self-assembly for MEMS

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1690-1695

  Harsh, K F ^a   Bright, V M ^a   Lee, Y C ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACIAL ENERGY; INTERMETALLICS; SELF ASSEMBLY; SOLDERING; SPHERES; SURFACE TENSION;

MICROSCALE LIMITS; MOLTEN SOLDER;

MICROELECTROMECHANICAL DEVICES;

EID: 0034479833     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)