Self-assembly of components using shape-matching

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 826-829

  Ong, Y Y ^a   Lim, Y L ^a   Yan, L L ^a   Vempati, S ^a   Liao, E B ^a   Kripesh, V ^a   Yoon, S U ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; ELECTROPLATING; LITHOGRAPHY; NONMETALS; SILICON; TECHNOLOGY;

LOCKING MECHANISM; MICRO-COMPONENTS; PACKAGING TECHNOLOGIES; SELF- ASSEMBLIES; SILICON SUBSTRATES;

SELF ASSEMBLY;

EID: 50049136216     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469815     Document Type: Conference Paper

References (4)

1. U. Srinivasan, M. A. Helmbrecht, C. Rembe, R. S. Muller, R. T. Howe, "Fluidic Self-Assembly of Micromirrors Onto Microactuators Using Capillary Forces", IEEE on selected topics in Quantum Electronics, vol. 8, No. 1, Jan/Feb, 2002
2. X. R. Xiong, Y. Hanein, J. D. Fang, Y. B. Wang, W. H. Wang, D. T. Schwartz, K. F. Bohringer, "Controlled Multibatch Self-Assembly of Microdevices", J. Microelectromech. Syst., vol. 12, no. 2, Apr 2003, pp. 117-127
3. J. Fang, K. F. Bohringer, "Parallel micro component-to-substrate assembly with controlled poses and high surface coverage", J. Micromech. Microeng., 16, 2006, pp. 721-730
4. Y. Y. Ong, Y. L. Lim, L. L. Yan, E. B. Liao, V. Kripesh, 'Dry Self-Assembly & Gang Bonding of Microcomponents from Silicon Carrier to Substrate Wafer', Proceedings to International Electronic Manufacturing Technology 2007, pp. 486-491