Programmable reconfigurable self-assembly: Parallel heterogeneous integration of chip-scale components on planar and nonplanar surfaces

Journal of Microelectromechanical Systems

Volumn 15, Issue 3, 2006, Pages 457-464

  Chung, Jaehoon ^a   Zheng, Wei ^a   Hatch, Thomas J ^a   Jacobs, Heiko O ^a  

^a University of Minnesota   (United States)

Author keywords

Directed assembly; Heterogeneous integration; Programmable microelectromechanical systems (MEMS); Reconfigurable self assembly; Sequential self assembly; Solder based receptor; Template assembly

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; CROSSTALK; LIGHT EMITTING DIODES; SELF ASSEMBLY; SEMICONDUCTOR DEVICES; SUBSTRATES;

DIRECTED ASSEMBLY; HETEROGENEOUS INTEGRATION; PROGRAMMABLE MICROELECTROMECHANICAL SYSTEMS (MEMS); RECONFIGURABLE SELF-ASSEMBLY; SOLDER-BASED RECEPTOR; TEMPLATE ASSEMBLY;

MICROELECTROMECHANICAL DEVICES;

EID: 33745180193     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2006.872226     Document Type: Article

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