Self-assembly of millimeter-scale components using integrated micromagnets

IEEE Transactions on Magnetics

Volumn 44, Issue 11 PART 2, 2008, Pages 4293-4296

  Shetye, Sheetal B ^a   Eskinazi, Ilan ^a   Arnold, David P ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

Embedded magnets; Hard magnets; Magnetic self assembly; Micromagnets

Indexed keywords

SELF ASSEMBLY; SUBSTRATES;

BONDING SURFACES; DIRECTED SELF-ASSEMBLY; DRY ENVIRONMENT; HARD MAGNETS; MICROFABRICATED; MICROMAGNETS; MILLIMETER-SCALE; PLANAR SUBSTRATE;

MAGNETS;

EID: 65949088511     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMAG.2008.2001344     Document Type: Article

References (17)

1. C. J. Morris, S. A. Stauth, and B. A. Parviz, "Self-assembly for microscale and nanoscale packaging: Steps toward self-packaging", IEEE Trans. Adv. Packag., vol. 28, no. 4, pp. 600-611, Nov. 2005.
2. H.-J. J. Yeh and J. S. Smith, "Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates", IEEE Photon. Technol. Lett., vol. 6, no. 6, pp. 706-708, 1994.
3. R. R. A. Syms, E. M. Yeatman, V. M. Bright, and G. M. Whitesides, "Surface tension-powered self-assembly of microstructure-The state-of-the-art", J. Microelectromech. Syst., vol. 12, no. 4, pp. 387-417, Aug. 2003.
4. U. Srinivasan, D. Liepmann, and R. T. Howe, "Microstructure to substrate self-assembly using capillary forces", J. Microelectromech. Syst., vol. 10, no. 1, pp. 17-24, Mar. 2001. (Pubitemid 32287836)
5. C. F. Edman, R. B. Swint, C. Gurtner, R. E. Formosa, S. D. Roh, K. E. Lee, P. D. Swanson, D. E. Ackley, J. J. Coleman, and M. J. Heller, "Electric field directed assembly of an InGaAs LED onto silicon circuitry", IEEE Photon. Technol. Lett., vol. 12, no. 9, pp. 1198-1200, 2000.
6. Y. Murakami et al., "Application of micromachine techniques to biotechnological research", Mat. Sci. Eng. C, vol. 12, pp. 67-70, 2000.
7. K. F. Böhringer, K. Y. Goldberg, M. B. Cohn, R. T. Howe, and A. P. Pisano, "Parallel microassembly using electrostatic force fields", in IEEE Int. Conf. Robotics and Automation (ICRA), Leuven, Belgium, May 1998, pp. 1204-1211.
8. S. B. Shetye, J. S. Agashe, and D. P. Arnold, "Investigation of microscale magnetic forces for magnet array self-assembly", IEEE Trans. Magn., vol. 43, no. 6, pp. 2713-2715, Jun. 2007.
9. B. Bowers, J. S. Agashe, and D. P. Arnold, "A method to form bonded micromagnets embedded in silicon", in Proc. 14th Int. Conf. Solid-State Sensors, Actuators, and Microsystems (Transducers 07), Jun. 2007, vol. 2, pp. 1581-1584.
10. J. S. Agashe and D. P. Arnold, "A study of scaling and geometry effects on the forces between cuboidal and cylindrical magnets using analytical force solutions", J. Phys. D-Appl. Phys., submitted for publication.
11. S. H. Liang, K. Wang, and K. F. Böhringer, "Self-assembly of MEMS components in air assisted by diaphragm agitation", in 18th IEEE Conf. Micro Electro Mechanical Systems (MEMS), Miami Beach, FL, Jan. 2005, pp. 592-595.
12. I. Zana and G. Zangari, "Co-Pt micromagnets by electrodeposition", J. Appl. Phys., vol. 91, no. 10, pp. 7320-7322, May 2002.
13. H. J. Cho, S. Bhansali, and C. H. Ahn, "Electroplated thick permanent magnet arrays with controlled direction of magnetization for MEMS application", J. Appl. Phys, vol. 87, no. 9, pp. 6340-6342, May 2000.
14. F. M. F. Rhen, E. Backen, and J. M. D. Coey, "Thick-film permanent magnets by membrane electrodeposition", J. Appl. Phys., vol. 97, pp. 113908-1-4, 2005.
15. S. E. Park, P. Y. Jung, and K. B. Kim, "Magnetic properties and microstructural analysis of sputter deposited and annealed Co-Pt alloys", J. Appl. Phys., vol. 77, no. 6, pp. 2641-2647, Mar. 1995.
16. T. S. Chin, "Permanent magnet films for applications in microelectromechanical systems", J. Magn. Magn. Mater., vol. 209, pp. 75-79, 2000.
17. S. Guan, B. J. Nelson, and K. Vollmers, "Electrochemical codeposition of magnetic particle-ferromagnetic matrix composites for magnetic MEMS actuator applications", J. Electrochem. Soc., vol. 151, no. 9, pp. C545-C549, 2004.