Parallel micro component-to-substrate assembly with controlled poses and high surface coverage

Journal of Micromechanics and Microengineering

Volumn 16, Issue 4, 2006, Pages 721-730

  Fang, J ^a   Bohringer K F ^a  

^a University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARITY; HYDROPHILICITY; HYDROPHOBICITY; SILICON; SUBSTRATES; VIBRATIONS (MECHANICAL);

CAPILLARY-DRIVEN SELF-ASSEMBLY; CAVITIES; DENSELY PACKED RECEPTOR SITES;

SURFACE PROPERTIES;

EID: 33645064258     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/4/008     Document Type: Article

References (14)

1. Yeh H J and Smith J S 1994 Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates IEEE Photon. Technol. Lett. 6 706-8
2. Jacobs H O, Tao A R, Schwartz A, Gracias D H and Whitesides G M 2002 Fabrication of cylindrical display by patterned assembly Science 296 323-5
3. Srinivasan U, Liepmann D and Howe R T 2001 Microstructure to substrate self-assembly using capillary forces IEEE J. Microelectromech. Syst. 10 17-24
4. Xiong X, Hanein Y, Fang J, Wang Y, Wang W, Schwartz D T and Böhringer K F 2003 Controlled multi-batch self-assembly of micro devices IEEE J. Microelectromech. Syst. 12 117-27
5. Zheng W, Chung J H and Jacobs H O 2005 Non-robotic fabrication of packaged microsystems by shape-and-solder directed self-assembly Proc. 18th IEEE Int. Conf. on Micro Electro Mechanical Systems(Miami Beach, FL)
6. Fang J, Wang K and Böhringer K F 2004 Self-assembly of micro pumps with high uniformity in performance Proc. Solid State Sensor, Actuator, and Microsystems Workshop (Hilton Head Island, SC) pp 208-11
7. Böhringer K F, Goldberg K, Cohn M, Howe R T and Pisano A 1998 Parallel microassembly with electrostatic force fields Proc. Int. Conf. on Robotics and Automation (Leuven, Belgium)
8. Cohn M B, Howe R T and Pisano A P 1995 Self-assembly of microsystems using non-contact electrostatic traps Proc. ASME Int. Congress and Exposition, Symp. on Micromechanical Systems (San Francisco, CA) pp 893-900
9. Perkins J, Rumpler J and Fonstad C G 2002 Magnetically assisted self-assembly-a new heterogeneous integration technique MIT Microsystems Technology Laboratories Annual Report
10. Fang J and Böhringer K F 2005 High yield batch packaging of micro devices with uniquely orienting self-assembly Proc. 18th IEEE Conf. on Micro Electro Mechanical Systems (Miami, FL) pp 12-5
11. Fang J and Böhringer K F 2005 Uniquely orienting dry micro assembly by two-stage shape recognition Proc. 13th Int. Conf. on Solid-State Sensors and Actuators (Seoul, Korea) pp 956-9
12. Pan C T, Chien C H and Hsieh C C 2004 Technique of microball lens formation for efficient optical coupling Appl. Opt. 43 5939-46
13. Swanson P J, Burridge R R and Koditschek D E 1995 Global asymptotic stability of a passive juggling strategy: a possible parts feeding method Math. Probl. Eng. 3 193-224
14. Kim S D, Shin C S, Kwak N J, Lee K B, Kwon O J and Kim C T 1997 Effects of the underlayer surface state on the interconnecting aluminum film properties Proc. Materials Research Society Spring'97 Meeting (San Francisco, CA, 31 March-4 April)