Shape-and-solder-direcled self-assembly to package semiconductor device segments

Applied Physics Letters

Volumn 85, Issue 16, 2004, Pages 3635-3637

  Zheng, Wei ^a   Jacobs, Heiko O ^a  

^a University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HYBRID MICROSYSTEMS; LIQUID SOLDERS; PACKAGE SEMICONDUCTOR DEVICES; SOLDER-DIRECTED SELF-ASSEMBLY;

ELECTRONICS PACKAGING; FABRICATION; GALLIUM NITRIDE; LIGHT EMITTING DIODES; MICROMACHINING; MICROMETERS; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTOR DEVICES; SOLDERING ALLOYS;

SELF ASSEMBLY;

EID: 9744276740     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1807017     Document Type: Article

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