Ultra-thin films and multigate devices architectures for future CMOS scaling

Science China Information Sciences

Volumn 54, Issue 5, 2011, Pages 990-1003

  Deleonibus, Simon ^a  

^a CEA LETI   (France)

Author keywords

3D sequential integration; Carbon; CMOSFETs; FDSOI; FinFET; Germanium; Multigates; Nanowires; Silicon; Silicon on insulator technology; Strain; Wafer bonding

Indexed keywords

EID: 79955865268     PISSN: 1674733X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11432-011-4231-x     Document Type: Article

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