Novel SOI-like structures for improved thermal dissipation

IEEE International SOI Conference

Volumn , Issue , 2002, Pages 95-96

  Oshima, K ^a   Cristoloveanu, S ^b   Guillaumot, B ^c   Carval, G L ^a   Deleonibus, S ^a   Iwai, H ^d   Mazure C ^e   Park, K H ^f  

^a CEA LETI   (France)

^b IMEP LAHC   (France)

^c STMICROELECTRONICS   (France)

^d TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^e PARC TECHNOLOGIQUE DES FONTAINES   (France)

^f COMTECS ^*  (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC MATERIALS; LINEARIZATION; MOSFET DEVICES; THERMAL DIFFUSION; THIN FILM DEVICES; ULSI CIRCUITS;

THERMAL DISSIPATION;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0036458324     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/soi.2002.1044432     Document Type: Conference Paper

References (0)