Wafer-scale microtensile testing of thin films

Journal of Microelectromechanical Systems

Volumn 18, Issue 5, 2009, Pages 1062-1076

  Gaspar, João ^a   Schmidt, Marek E ^a   Held, Jochen ^a   Paul, Oliver ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

Brittle materials; Ductile materials; Mechanical properties; Microtensile test; Thin films; Wafer scalemeasurements

Indexed keywords

AL FILMS; BEST ESTIMATES; BRITTLE MATERIALS; CONFIDENCE INTERVAL; DUCTILE MATERIALS; FAST ACQUISITION; GAUSSIANS; HIGH-THROUGHPUT; LIKELIHOOD RATIO METHOD; MATERIAL PROPERTY; MECHANICAL CHARACTERIZATIONS; MICROMACHINED; MICROTENSILE; MICROTENSILE SPECIMENS; MICROTENSILE TEST; MICROTENSILE TESTING; MULTIPLE TEST; POLY-SI; POLYCRYSTALLINE SILICON (POLY-SI); SILICON SUBSTRATES; SUBMICROMETERS; TEST STRUCTURE; WAFER SCALE; WAFER-SCALEMEASUREMENTS; WEIBULL MODULUS; WEIBULL STATISTICS; YOUNG'S MODULUS;

ALUMINA; ALUMINUM; BRITTLENESS; DUCTILITY; ELASTIC MODULI; ELASTICITY; EXTRACTION; MATERIALS PROPERTIES; MAXIMUM LIKELIHOOD ESTIMATION; MECHANICAL PROPERTIES; PLASMA DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POLYCRYSTALLINE MATERIALS; POLYSILICON; SILICON NITRIDE; TENSILE STRENGTH; THICK FILMS; THIN FILMS; VAPORS; WEIBULL DISTRIBUTION;

SILICON WAFERS;

EID: 70349992886     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2009.2029210     Document Type: Article

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