Tensile tests of various thin films

ASTM Special Technical Publication

Volumn , Issue 1413, 2001, Pages 229-247

  Sharps Jr , William N ^a   Jackson, Kamili M ^a   Coles, George ^a   Eby, Matthew A ^a   Edwards, Richard L ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

Fracture strength; Poisson's ratio; Polysilicon; Silicon nitride; Temperature; Thin films; Young's modulus

Indexed keywords

ELASTIC MODULI; FRACTURE TOUGHNESS; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; POISSON RATIO; POLYSILICON; SCANNING ELECTRON MICROSCOPY; SILICON NITRIDE; TENSILE TESTING;

ELECTROSTATIC PROBE; NANOINDENTER; STRESS GRADIENTS;

THIN FILMS;

EID: 8844250083     PISSN: 00660558     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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