Prediction of fatigue lifetime based on static strength and crack extension law - Fatigue test of MEMS materials becomes unnecessary

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 431-434

  Kawai, T ^a   Amaki, S ^a   Gaspar, J ^b   Ruther, P ^b   Paul, O ^b   Kamiya, S ^a  

^a NAGOYA INSTITUTE OF TECHNOLOGY   (Japan)

^b UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; CRACKS; ESTIMATION; FATIGUE CRACK PROPAGATION; FATIGUE DAMAGE; FATIGUE TESTING; LAWS AND LEGISLATION; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; NONMETALS; PARAMETER ESTIMATION; POLYSILICON; REACTIVE ION ETCHING; SILICON; TENSILE TESTING; TESTING; THICK FILMS;

CRACK EXTENSIONS; CYCLIC LOADINGS; EQUIVALENT CRACK; ETCHING DAMAGE; FATIGUE CRACKS; FATIGUE LIFE-TIME; FATIGUE TESTS; INITIAL DAMAGE; INTERNATIONAL CONFERENCES; MEMS MATERIALS; MICRO-ELECTRO MECHANICAL SYSTEMS; PARIS LAW; POLY-CRYSTALLINE SILICON; QUASI-STATIC TENSILE TESTS; STATIC STRENGTHS; UNKNOWN PARAMETERS;

FATIGUE OF MATERIALS;

EID: 50149091318     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443685     Document Type: Conference Paper

References (9)

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