Highly efficient extraction of mechanical and linear and quadratic piezoresistive properties of poly-Si films using wafer-scale microtensile testing

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2009, Pages 599-602

  Schmidt, M E ^a   Gaspar, J ^a   Held, J ^a   Kamiya, S ^b   Paul, O ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b NAGOYA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH-THROUGHPUT METHOD; IN-SITU; MICROTENSILE; MICROTENSILE TESTING; N-DOPED; PIEZO-RESISTIVE; PIEZORESISTIVE COEFFICIENTS; PIEZORESISTIVE PROPERTIES; POLY-SI; POLY-SI FILMS; SECOND ORDERS; SENSING APPLICATIONS; STATISTICAL SIGNIFICANCE; STRESS AND STRAIN; WAFER-SCALE;

MECHANICAL PROPERTIES; POLYSILICON; SILICON WAFERS; STRAIN; STRESSES;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 65949118502     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2009.4805453     Document Type: Conference Paper

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