Bent-beam strain sensors

Journal of Microelectromechanical Systems

Volumn 5, Issue 1, 1996, Pages 52-58

  Gianchandani, Yogesh B ^{a,b,c,d,e,f,g}   Najafi, Khalil ^a,b  

^a IEEE

^b UNIVERSITY OF MICHIGAN   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

^e XEROX CORPORATION   (United States)

^f Microchip Technology

^g Eta Kappa Nu ^*

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROMACHINING; POLYCRYSTALLINE MATERIALS; RESIDUAL STRESSES; SEMICONDUCTING BORON; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE STRUCTURES; SINGLE CRYSTALS; STRAIN; SURFACES;

BUCKLING DEVICES; DISSOLVED WAFER PROCESS; NONUNIFORM DISTRIBUTION; PASSIVE STRAIN SENSORS; POLYCRYSTALLINE SILICON; POLYSILICON THIN FILMS; SURFACE MICROMACHINING;

SENSORS;

EID: 0030109553     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.485216     Document Type: Article

References (18)

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