Out of plane vs in plane flexural behaviour of thin polysilicon films: Mechanical characterization and application of the Weibull approach

Microelectronics Reliability

Volumn 45, Issue 9-11, 2005, Pages 1758-1763

  Cacchione, F ^a   Corigliano, A ^a   De Masi, B ^b   Riva, C ^b  

^a POLITECNICO DI MILANO   (Italy)

^b STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; CAPACITANCE; COMPUTER SIMULATION; ELASTICITY; ELECTRODES; ELECTROSTATICS; MATHEMATICAL MODELS; MECHANICAL TESTING; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; RELIABILITY; THIN FILMS; WEIBULL DISTRIBUTION;

ELASTIC PROPERTIES; FLEXURAL BEHAVIOR; POLYSILICON FILMS; WEIBULL APPROACH;

POLYSILICON;

EID: 24144436225     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.090     Document Type: Conference Paper

References (9)

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9. Cacchione F, De Masi B, Corigliano A, Ferrera M. Rupture tests on polysilicon films through on-chip electrostatic actuation, Proceedings: Eurosime04, Brussels, 9-12 May 2004. Extended version submitted to Sensor Letters, 2005.