Microscale material testing of single crystalline silicon: Process effects on surface morphology and tensile strength

Sensors and Actuators, A: Physical

Volumn 83, Issue 1, 2000, Pages 172-178

  Yi, Taechung ^a   Li, Lu ^a   Kim, Chang Jin ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALCOHOLS; AMMONIUM COMPOUNDS; CRYSTAL ORIENTATION; ELASTIC MODULI; ETCHING; FLUORINE COMPOUNDS; MORPHOLOGY; POTASSIUM COMPOUNDS; SINGLE CRYSTALS; STRAIN RATE; STRESS ANALYSIS; TENSILE STRENGTH;

ETHYLENE DIAMINE PYROCATECHOL; POTASSIUM HYDROXIDE; TETRAMETHYL AMMONIUM HYDROXIDE; XENON DIFLUORIDE;

SILICON WAFERS;

EID: 0033750801     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(00)00350-2     Document Type: Article

References (11)

1. Dieter G.E. Mechanical Metallurgy. 1986;McGraw-Hill, New York.
2. McSkimin H.J. Measurement of elastic constants at low temperatures by means of ultrasonic waves - data for silicon and germanium single crystals, and for fused silica. J. Appl. Phys. 24:1953;988-997.
3. Thurston R.N., Brugger K. Third-order elastic constants and the velocity of small amplitude elastic waves in homogeneously stressed media. Phys. Rev. 133:1964;A1604-A1610.
4. Hall J. Electronic effects in the elastic constants of n-type silicon. Phys. Rev. 161:1967;756-761.
5. ASTM Standard C 623-92, Standard Test Method for Young's Modulus, Shear Modulus, and Poisson's Ratio for Glass and Glass-Ceramic by Resonance, Annual Book of ASTM Standards.
6. Brantley W. Calculated elastic constants for stress problems associated with semiconductor devices. J. Appl. Phys. 44:1973;534-535.
7. Sharpe W.N. Jr., Yuan B., Edwards R.L. A new technique for measuring the mechanical properties of thin films. J. Microelectromech. Syst. 6:1997;193-199.
8. Sato K., Shikida M., Yoshioka T., Ando T., Kawabata T. Micro tensile-test of silicon film having different crystallographic orientations. Tech. Digest, Int. Conf. Solid-State Sensors and Actuators, Chicago, IL, USA, June 16-19:1996;595-598.
9. Saif M., MacDonald N. Microinstruments for submicron material studies. J. Mater. Res. 13:1998;3353-3356.
10. Wilson C.J., Beck P.A. Fracture testing of bulk silicon microcantilever beam subjected to a side load. J. Microelectromech. Syst. 5:1996;142-150.
11. L.-S. Huang, Silicon Bulk Micromachining in MEMS Packaging and Optical Applications, PhD Dissertation, Mechanical and Aerospace Engineering Department, University of California, Los Angeles, 1999.