Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers

Acta Materialia

Volumn 48, Issue 12, 2000, Pages 3261-3269

  Huang, Haibo ^a   Spaepen, F ^a  

^a HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILITY; ELASTIC MODULI; GRAIN BOUNDARIES; LITHOGRAPHY; METALLIC FILMS; MULTILAYERS; POLYCRYSTALLINE MATERIALS; STRAIN; TENSILE TESTING; THICKNESS MEASUREMENT; YIELD STRESS;

FREE STANDING POLYCRYSTALLINE THIN FILMS; MICROLITHOGRAPHIC TECHNIQUES; STRESS STRAIN RELATIONSHIP MEASUREMENTS;

THIN FILMS;

EID: 0034226704     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(00)00128-2     Document Type: Article

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