Murray lecture tensile testing at the micrometer scale: Opportunities in experimental mechanics

Experimental Mechanics

Volumn 43, Issue 3, 2003, Pages 228-237

  Sharpe Jr , William N ^a  

^a Johns Hopkins University   (United States)

Author keywords

Experimental mechanics; MEMS; Polysilicon; Silicon nitride; Tensile testing; Young's modulus

Indexed keywords

BRITTLENESS; FRACTURE TOUGHNESS; MICROELECTROMECHANICAL DEVICES; MICROMETERS; NICKEL; POISSON RATIO; POLYSILICON; SILICON CARBIDE; SILICON NITRIDE; THIN FILMS;

SOLID MECHANICS;

TENSILE TESTING;

FATIGUE ANALYSIS; MICROELECTROMECHANICAL SYSTEM; SILICON NITRIDE; TENSILE STRENGTH; YOUNG MODULUS;

EID: 0141940253     PISSN: 00144851     EISSN: None     Source Type: Journal    
DOI: 10.1007/bf02410521     Document Type: Article

References (44)

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