Annealing temperature dependent strength of polysilicon measured using a novel tensile test structure

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 185-188

  Kamiya, S ^a   Kuypers, J ^a   Trautmann, A ^a   Ruther, P ^a   Paul, O ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BUFFERS; LOW TEMPERATURE OXIDES (LTO); TEST STRUCTURES;

ANNEALING; DEFECTS; DEPOSITION; MICROELECTROMECHANICAL DEVICES; STRESSES; SUBSTRATES; TENSILE TESTING; THERMAL EFFECTS;

POLYSILICON;

EID: 3042697041     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2003.1189717     Document Type: Conference Paper

References (6)

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