Cross comparison of thin-film tensile-testing methods examined using single-crystal silicon, polysilicon, nickel, and titanium films

Journal of Microelectromechanical Systems

Volumn 14, Issue 5, 2005, Pages 1178-1186

  Tsuchiya, Toshiyuki ^a,b   Hirata, Masakazu ^c   Chiba, Norio ^c   Udo, Ryujiro ^d   Yoshitomi, Yuji ^d   Ando, Taeko ^e   Sato, Kazuo ^e   Takashima, Kazuki ^f   Higo, Yakichi ^f   Saotome, Yasunori ^g   Ogawa, Hirofumi ^h   Ozaki, Koichi ^h  

^a Rd Management Section   (Japan)

^b KYOTO UNIVERSITY   (Japan)

^c SEIKO INSTRUMENTS INC   (Japan)

^d HITACHI LTD   (Japan)

^e NAGOYA UNIVERSITY   (Japan)

^f TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^g GUNMA UNIVERSITY   (Japan)

^h NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Mechanical properties; Standardization; Tensile testing; Thin film

Indexed keywords

ELASTIC MODULI; FRACTURE TOUGHNESS; MECHANICAL PROPERTIES; MICROELECTROMECHANICAL DEVICES; NICKEL; POLYSILICON; SEMICONDUCTING SILICON; STANDARDIZATION; TENSILE STRENGTH; TENSILE TESTING; THIN FILMS; TITANIUM;

FRACTURE STRAIN; SINGLE CRYSTAL SILICON; THIN-FILM PROPERTIES; THIN-FILM TENSILE-TESTING;

SEMICONDUCTING FILMS;

EID: 27644572982     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2005.851820     Document Type: Article

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