Micro-tensile tests on micromachined metal on polymer specimens: Elasticity, plasticity and rupture

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2008, Pages 8-10

  Seguineau, C ^a,b   Ignat, M ^b   Malhaire, C ^c   Brida, S ^d   Lafontan, X ^a   Desmarres, J M ^e   Josserond, C ^b   Debove, L ^b  

^a Nova MEMS   (France)

^b UNIV GRENOBLE ALPES   (France)

^c UNIVERSITÉ DE LYON   (France)

^d AUXITROL SA   (France)

^e CNES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; DEFORMATION; ELECTROMECHANICAL DEVICES; MECHANICAL ACTUATORS; MICROELECTRONICS; PIEZOELECTRIC ACTUATORS; TENSILE TESTING;

DYNAMIC CHARACTERIZATION; MECHANICAL ACTUATIONS; MECHANICAL CHARACTERIZATIONS; MECHANICAL PARAMETERS; MICRO ELECTROMECHANICAL SYSTEM (MEMS); MICRO TENSILE TESTS; THIN COPPER FILMS; UNIAXIAL TENSILE TEST;

MOEMS;

EID: 62249193595     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2008.4752941     Document Type: Conference Paper

References (4)

1. D.T. Read, Y.W. Cheng and R. Geiss, "Morphology, microstructure, and mechanical properties of a copper electrodeposit," Microelectronic Engineering, 75 (2004) 63-70.
2. H. Huang and F. Spaepen, "Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers," Acta. mater, 48 (2000) 3261-3269.
3. S.W. Han, H.W. Lee, H.J. Lee, J.Y. Kim, C.S. Oh and S.H. Choa, "Mechanical properties of Au thin film for application in MEMS/NEMS using microtensile test," Current Applied Physics, 6S1 (2006) e81-e85.
4. C. Malhaire, M. Ignat, K. Dogheche, S. Brida, C. Josserond and L. Debove. "Realization of thin film specimens for micro tensile tests," Transducers'07, June 10-14, 2007, Lyon, France.