Evaluation of the mechanical properties of aluminum thin films as a function of strain rate using the wafer-scale microtensile technique

Materials Research Society Symposium Proceedings

Volumn 1139, Issue , 2009, Pages 211-216

  Gaspar, Joao ^a   Schmidt, Marek E ^a   Held, Jochen ^a   Paul, Oliver ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM THIN FILMS; AUTOMATED SETUP; FIXED FRAMES; FRACTURE STRAIN; IN-PLANE; LOAD-DISPLACEMENT DATA; MECHANICAL CHARACTERIZATIONS; MICROMACHINED; MICROTENSILE; MICROTENSILE SPECIMENS; MULTIPLE TEST; SILICON SUBSTRATES; STRAIN-HARDENING EXPONENT; TEST STRUCTURE; ULTIMATE TENSILE STRENGTH; UNIAXIAL ELONGATION; WAFER-SCALE; YIELD STRENGTH; YOUNG'S MODULUS;

ALUMINUM; MECHANICAL PROPERTIES; MEMS; MICROELECTROMECHANICAL DEVICES; OPTICAL FILMS; SILICON WAFERS; STRESS-STRAIN CURVES; STRESSES; TENSILE STRENGTH; THIN FILMS;

STRAIN RATE;

EID: 70349998651     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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