Temperature-dependent microtensile testing of thin film materials for application to microelectromechanical system

Microsystem Technologies

Volumn 12, Issue 10-11, 2006, Pages 1045-1051

  Lin, Ming Tzer ^a   El Deiry, Paul ^b   Chromik, Richard R ^b   Barbosa, Nicholas ^b   Brown, Walter L ^b   Delph, Terry J ^b   Vinci, Richard P ^b  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD; SILICA; TENSILE TESTING; THERMAL EFFECTS; THIN FILMS;

MEMS-APPLICABLE THIN FILMS; MICROELECTROMECHANICAL SYSTEM; MICROTENSILE APPARATUS;

MICROELECTROMECHANICAL DEVICES;

EID: 33747588983     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0129-8     Document Type: Conference Paper

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