Size effect on the mechanical properties and reliability analysis of microfabricated polysilicon thin films

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2001, Pages 106-111

  Ding, J N ^a   Meng, Y G ^a   Wen, S Z ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Mechanical properties; Microelectromechanical systems; Polysilicon; Size effect; Strain analysis

Indexed keywords

ACTUATORS; CHEMICAL VAPOR DEPOSITION; ELASTIC MODULI; FAILURE ANALYSIS; FRACTURE TOUGHNESS; POLYSILICON; RELIABILITY; STATISTICAL METHODS; STRAIN; TENSILE STRENGTH; TENSILE TESTING; THIN FILMS;

LOW PRESSURE CHEMICAL VAPOR DEPOSITION; MICROELECTROMECHANICAL SYSTEMS; SIZE EFFECT; STRAIN ANALYSIS;

MICROELECTROMECHANICAL DEVICES;

EID: 0034956751     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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