M-test: A test chip for MEMS material property measurement using electrostatically actuated test structures

Journal of Microelectromechanical Systems

Volumn 6, Issue 2, 1997, Pages 107-118

  Osterberg, Peter M ^{b,c,d,e,f,g,h,i,j}   Senturia, Stephen D ^a,b,d,k,l,m  

^a IEEE

^b USA   (United States)

^c UNIVERSITY OF PORTLAND   (United States)

^d MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^e TEXAS INSTRUMENTS   (United States)

^f Network System Research Laboratory   (United States)

^g GTE Inc   (United States)

^h HEWLETT PACKARD COMPANY   (United States)

ⁱ MaxiMEM Limited   (United States)

^j MaxiMEM Limited ^*  (United States)

^k HARVARD UNIVERSITY   (United States)

^l Transducer Research Foundation

^m Micromet Instruments Inc   (United States)

more..

Author keywords

Computer aided design for microelectromechanical systems; Material properties; MEMCAD; MEMS; MEMS modeling; Microactuators; Microelectromechanical systems; Microfabrication; Micromachining; Microsensors; Microstructures; Plate modulus; Poisson ratio

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; ELASTIC MODULI; ELECTROSTATICS; MECHANICAL TESTING; MICROMACHINING; MICROSTRUCTURE; MOSFET DEVICES;

MICROSENSORS;

MICROELECTROMECHANICAL DEVICES;

EID: 0031168990     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.585788     Document Type: Article

References (22)

1. S. D. Senturia, "Microfabricated structures for the measurement of mechanical properties and adhesion," in Proc. Transducers 87, Tokyo, Japan, pp. 11-16.
2. K. E. Petersen, "Dynamic micromechanics on silicon: Techniques and devices," IEEE Trans. Electron Devices, vol. ED-25, no. 10, pp. 1241-1250, 1978.
3. H. A. C. Tilmans, "Micro-mechanical sensors using encapsulated builtin resonant strain gauges," Ph.D. dissertation, MESA Research Instit. Univ. Twente, Enschede, The Netherlands, 1993.
4. F. Maseeh, M. A. Schmidt, M. G. Allen, and S. D. Senturia, "Calibrated measurements of elastic limit, modulus, and the residual stress of thin films using micromachined suspended structures," in IEEE Solid State Sensor and Actuator Workshop, Hilton Head Island, SC, June 6-9, 1988, pp. 84-87.
5. S. Wang, S. Crary, and K. Najafi, "Electronic determination of the modulus of elasticity and intrinsic stress of thin films using capacitive bridges," in Mat. Res. Soc. Symp. Proc., 1992, pp. 203-208.
6. J. A. Schweitz, "Mechanical characterization of thin films by micromechanical techniques," MRS Bull., pp. 34-45, July 1992.
7. M. G. Allen, M. Mehregany, R. T. Howe, and S. D. Senturia, "Microfabricated structures for the in-situ measurement of residual stress, Young's modulus, and ultimate strain of thin films," Appl. Phys. Lett., vol. 51, pp. 241-243, 1987.
8. K. Najafi and K. Suzuki, "A novel technique and structure for the measurement of intrinsic stress and Young's modulus of thin films," in Proc. MEMS 89, Salt Lake City, UT, pp. 96-97.
9. W. A. Brantley, "Calculated elastic constants for stress problems associated with semiconductor devices," J. Appl. Phys., vol. 44, no. 1, pp. 534-535, 1973.
10. J. R. Gilbert, P. Osterberg, R. Harris, D. Ouma, A. Pfajfer, J. White, and S. D. Senturia, "Implementation of a MEMCAD system for electrostatic and mechanical analysis of complex structures from mask descriptions," in Proc. MEMS 93, Fort Lauderdale, FL, pp. 207-212.
11. J. R. Gilbert, R. Legtenberg, and S. D. Senturia, "3D coupled electromechanics for MEMS: Applications of CoSolve-EM," in Proc. MEMS 95, Amsterdam, The Netherlands, pp. 122-127.
12. C. H. Hsu and M. A. Schmidt, "Micromachined structures fabricated using wafer-bonded sealed cavity process," in Proc. 1994 Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 151-155.
13. P. Osterberg, R. Gupta, J. Gilbert, and S. Senturia, "Quantitative models for the measurement of residual stress, poisson ratio, and Young's modulus using electrostatic pull-in of beams and diaphragms," in Proc. 1994 Solid-State Sensor and Actuator Workshop, Hilton Head, SC, pp. 184-188.
14. P. Osterberg, H. Yie, X. Cai, J. White, and S. Senturia, "Self-consistent simulation and modeling of electrostatically deformed diaphragms," in Proc. MEMS 94, Oiso, Japan, pp. 28-32.
15. P. M. Osterberg, "Electrostatically actuated microelectromechancial test structures for material property measurement," Ph.D. dissertation, Mass. Instil. Tech., Cambridge, MA, 1995.
16. W. C. Young, Roark's Formulas for Stress and Strain. New York: McGraw-Hill, 1989, pp. 176-177.
17. S. Timoshenko, Theory of Plates and Shells. New York: McGraw-Hill, 1987, pp. 4-6, 118, 125.
18. MATLAB Version 4.2C, The Mathworks Inc., Natick, MA.
19. Kaleidagraph Version 2.1.3, Synergy Software, Inc., Reading. PA.
20. R. K. Gupta, C. H. Hsu, M. A. Schmidt, and S. D. Senturia, "Monitoring plasma over-etching of wafer-bonded microstructures," in Proc. Transducers 95, Stockholm, Sweden, pp. 269-272.
21. R. K. Gupta, Ph.D. dissertation, Mass. Instit. Tech., Cambridge, in progress.
22. P. Congdon and Texas Instruments, Inc., private communication, 1993-95.