Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films

Journal of Microelectromechanical Systems

Volumn 7, Issue 1, 1998, Pages 106-113

  Tsuchiya, Toshiyuki ^a,c,d,o   Tabata, Osamu ^a,b,e,f,o   Sakata, Jiro ^a,c,g,h   Taga, Yasunori ^{a,e,i,j,k,l,m,n,o}  

^a Rd Management Section   (Japan)

^b RITSUMEIKAN UNIVERSITY   (Japan)

^c UNIVERSITY OF TOKYO   (Japan)

^d Institute of Electrical Engineers of   (Japan)

^e NAGOYA INSTITUTE OF TECHNOLOGY   (Japan)

^f Inst Elec Engineers Japan Soc M   (Japan)

^g NAGOYA UNIVERSITY   (Japan)

^h Advanced Device Laboratory   (Japan)

ⁱ OSAKA UNIVERSITY   (Japan)

^j DENSO CORPORATION   (Japan)

^k Chemical Sensor Society of Japan   (Japan)

^l AMERICAN INSTITUTE OF PHYSICS   (United States)

^m American Vacuum Society   (United States)

ⁿ Materials Research Society   (United States)

^o IEEE   (Japan)

more..

Author keywords

Electrostatic force grip; Fracture surface; Polysilicon; Specimen size effect; Tensile strength; Weibull plot

Indexed keywords

MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SILICON; TENSILE STRENGTH; TENSILE TESTING; THIN FILMS; WEIBULL DISTRIBUTION;

ELECTROSTATIC FORCE GRIP; POLYCRYSTALLINE SILICON;

POLYCRYSTALLINE MATERIALS;

EID: 0032026436     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.661392     Document Type: Article

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