Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 478-484

  Kang, Sung K ^a   Cho, Moon Gi ^b   Shih, Da Yuan ^a   Seo, Sun Kyoung ^b   Lee, Hyuck Mo ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; ALLOYING ELEMENTS; ARSENIC COMPOUNDS; BRAZING; COMPUTER NETWORKS; COPPER; DISSOLUTION; INTERMETALLICS; LEAD; LEAD ALLOYS; MECHANICAL PROPERTIES; MECHANISMS; METAL RECOVERY; MICROELECTRONICS; NICKEL; NICKEL ALLOYS; ORES; RATE CONSTANTS; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING; THERMODYNAMIC PROPERTIES; WELDING;

INTERFACIAL REACTIONS; MINOR ALLOYING;

TIN;

EID: 51449103945     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550015     Document Type: Conference Paper

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