Tin-silver-copper: A lead free solder for broad applications

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 2, Issue , 1996, Pages 882-885

  Anderson, Iver E ^a  

^a IOWA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BATH PROCESSING; MICROSTRUCTURAL ANALYSIS; SOLDER PASTE; TERNARY EUTECTIC ALLOY;

ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; ENVIRONMENTAL IMPACT; EUTECTICS; MICROSTRUCTURE; PHASE DIAGRAMS; TERNARY SYSTEMS;

SOLDERING ALLOYS;

EID: 0029723864     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)