The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 695-702

  Kang, Sung K ^a   Lauro, Paul ^a   Shin, Da Yuan ^a   Henderson, Donald W ^b   Bartelo, Jay ^b   Gosselin, Timothy ^b   Cain, Steve R ^b   Goldsmith, Charles ^c   Puttlitz, Karl ^c   Hwang, Tae K ^d   Choi, Won K ^e  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

^c IBM   (United States)

^d Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^e Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Ag3Sn plates; Ball grid arrays (BGA); Failure analysis; Fatigue life; Lead free solders; Microhardness; Thermal cycling test; Tin silver copper alloys

Indexed keywords

ELECTRONICS INDUSTRY; EUTECTICS; FAILURE ANALYSIS; METALLIZING; MICROHARDNESS; MICROSTRUCTURE; NUCLEATION; OPTIMIZATION; RELIABILITY; SOLIDIFICATION; TERNARY SYSTEMS; THERMAL CYCLING; TIN ALLOYS;

AG3SN PLATES; BALL GRID ARRAYS (BGA); LEAD-FREE SOLDERS; THERMAL CYCLING TESTS; THERMAL FATIGUE; TIN-SILVER-COPPER ALLOYS;

SOLDERED JOINTS;

EID: 2442575860     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.695     Document Type: Article

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