The electromigration and thermomigration behaviors of Pb-free flip chip Sn-3Ag-0.5Cu solder bumps

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 667-672

  Lin, Kwang Lung ^a   Kuo, Shi Ming ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; ENERGY DISPERSIVE SPECTROSCOPY; HEAT LOSSES; INTERMETALLICS; MASS TRANSFER; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THERMAL GRADIENTS;

CURRENT STRESSING; MASS ANALYSIS; SOLDER BUMPS; THERMOMIGRATION;

FLIP CHIP DEVICES;

EID: 33845577200     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645722     Document Type: Conference Paper

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