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Volumn 53, Issue 6, 2001, Pages 16-

Recent progress in Pb-free solders and soldering technologies

(1) Kang, S K a

a IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELECTRONICS PACKAGING; INTERMETALLICS; LEAD; MORPHOLOGY; SOLDERING ALLOYS; THERMAL STRESS; WETTING;

LEAD FREE SOLDERS; PIN IN HOLE SOLDERING;

SOLDERING;

EID: 0035359593 PISSN: 10474838 EISSN: None Source Type: Journal
DOI: 10.1007/s11837-001-0096-6 Document Type: Note

Times cited : (17)

References (14)

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2
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3
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4
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5
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6
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- (ASME, New York, NY)
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7
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- ed. R.K. Mahidhara et al. (Warrendale, PA: TMS)
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- Choi, S.L.¹

8
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- Habu, K.¹

9
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- July
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- Ylikoki, T.L.¹

10
- 0000098799
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- Kang, S.K.¹

11
- 0002900104
- (IEEE, Piscataway, NJ)
- (2000) Proc. 50th Electron. Comp. and Technol. Conf. , pp. 1405
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12
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- Snowdon, K.G.¹

13
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- (2000) Paper Presented at the Packaging Assembly Symposium, Binghamton, NY, 15-17 November 2000
- Mawer, A.¹

14
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- (IPC, Northbrook, IL, in print)
- Proc. APEX2001
- Bartelo, J.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.