Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 360-365

  Lu, Minhua ^a   Lauro, Paul ^a   Shih, Da Yuan ^a   Polastre, Robert ^a   Goldsmith, Charles ^b   Henderson, Donald W ^b   Zhang, Hongqing ^c   Cho, Moon Gi ^d  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

^c LEHIGH UNIVERSITY   (United States)

^d Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

SOLDER JOINTS; SURFACE FINISHING;

ALLOYS; ARSENIC COMPOUNDS; BRAZING; COMPUTER NETWORKS; COPPER; COPPER ALLOYS; ELECTROMIGRATION; EXPERIMENTS; FLUID MECHANICS; LEAD; METALLIC COMPOUNDS; NICKEL; NICKEL ALLOYS; ORES; RELIABILITY ANALYSIS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; SURFACES; TIN ALLOYS; WELDING;

TIN;

EID: 51349136376     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549996     Document Type: Conference Paper

References (15)

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8. Lu, M, unpublished results
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