The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 459-465

  Arfaei, B ^a   Xing, Y ^a   Woods, J ^a   Wolcott, J ^a   Tumne, P ^b   Borgesen, P ^b   Cotts, E ^a  

^a BINGHAMTON UNIVERSITY   (United States)

^b Unovis Solutions   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SN GRAINS; SN-AG-CU SOLDER;

BRAZING; COMPUTER NETWORKS; SOLDERED JOINTS; WELDING;

TIN;

EID: 51349119304     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550012     Document Type: Conference Paper

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